[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - High Sensitivity Ultrasonic Inspection Technique Using Pulse Compression Method

摘要： We developed an ultrasonic inspection technique using a pulse compression method for detecting bonding defects with interfaces of stacked wafers. This technique can detect the minute echoes reflected from the bonding interfaces by computing the correlation function between transmitted and received signals. We designed a measurement condition for pulse compression with a transmitted signal and took an ultrasonic measurement of a 3-layer stacked sample. We compared the defect detection sensitivity of the pulse compression method with the ultrasonic inspection using pulse waves. The experimental results showed that the noise of an ultrasonic image was reduced and minute defects could be detected by applying developed method.