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Handbook of Mechanics of Materials || Surface/Interface Stress and Thin Film Stress
摘要: Thin ?lm stress is critical for the reliability and electronic/optoelectronic properties of thin ?lm devices. In this chapter, we systematically discussed the effects of surface and interface stresses on the ?lm stress development during growth of polycrystalline ?lms at the initial and ?nal growth stage. We demonstrate that surface stress plays an important role at the initial stage of ?lm growth (island growth stage), and conventional stress analysis technology such as wafer curveture experiments may not be applicable at this stage. At the late stage of ?lm growth, we also show that adatom insertion into the grain boundaries is the primary mechanism of compressive stress development.
关键词: interface stress,Thin ?lm stress,adatom insertion,wafer curvature,grain boundaries,surface stress,polycrystalline ?lms
更新于2025-09-10 09:29:36