High-Temperature Cycle Durability of Superplastic Al-Zn Eutectoid Solder Joints with Stress Relaxation Characteristics for SiC Power Semiconductor Devices

摘要： We have developed a new high-temperature Al-Zn lead-free soldering process that utilizes superplasticity to realize SiC power devices with high-temperature cycle durability. The joining process consists of an Al-78wt.%Zn preparation being sandwiched by a SiC die and insulation substrate, an interfacial cleaning process at approximately 250-270oC, a heating stage to reach the solid-liquid coexisting temperature of 420-430oC, the ejection of low-melting-temperature β(Zn) from the joining area by press stress, and the transformation to a superplastic composition, i.e., Al-70 wt.% Zn at 270-310oC. Many lamellar phases that enable superplasticity can be formed in this microstructure. This solder joint composition was proven to have a better stress-relaxation effect than eutectic Al-95wt.%Zn, and the composition shows a much higher damping capability at the maximum operating temperature of SiC devices (200oC) than that of other joining candidates. The outstanding temperature cycle durability was verified in temperature cycle tests from -40oC to 300oC for 5000 cycles. This durability is due to the high-stress-relaxation effect from the superplasticity transformation realized by the lamellar structures in the Al-Zn alloy solder.