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- 摘要
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- 实验方案
- 产品
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[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden, Germany (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - Integration with Light
摘要： This paper reports the use of Laser-induced Forward Transfer (LIFT) technology for printing of multilayer flexible circuitries and the fabrication of micro-bumps for flip-chip bonding of packaged LEDs and bare die microcomponents. Bonding of passive and functional surface mount devices (SMD) on low-temperature polyethylene terephthalate (PET) foils have been demonstrated using two selective bonding techniques. Firstly, using a high intensity near-infrared (NIR) lamp, a bare die NFC chip was bonded on micro-bumps formed with LIFT printed isotropic conductive adhesive (ICA) within less than a minute. Secondly, using a high intensity Xenon lamp, passive components and packaged LEDs were bonded within 5 seconds on micro-bumps formed with conventional Sn–Ag–Cu (SAC) lead-free alloys. In the both cases, due to selective light absorption, a limited temperature increase was observed in the PET substrates allowing successful bonding of components onto the delicate polyethylene foil substrates using conventional interconnect materials.
关键词： LIFT,low temperature bonding,NIR curing,conductive adhesive,lead-free SAC solder,photonic soldering,flip-chip bonding,laser printing
更新于2025-09-23 15:23:52
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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Vertical Laser Assisted Bonding for Advanced "3.5D" Chip Packaging
摘要： In this work the processes of laser assisted bonding (LAB) is compared to thermal compression bonding (TCB). Their respective advantages and disadvantages regarding the assembly of flip chip stacks are compared. It is found, that the LAB allows for faster processing, negligible compression force and creates less internal stress in the chip stack. The concept of “3.5D” stacking is introduced. This new concept allows for the vertical bonding of chips/semiconductors to the sides of a chip stack. The vertically bonded parts can be used to contact the layers, which eliminates the individual necessity for through silicon vias (TSVs).
关键词： 3D-packaging,Silicon interposer,Thermal compression bonding (TCB),Inter metallic phase (IMC-layer),Laser assisted bonding (LAB),System on Package (SOP),Laser beam modulation,vertical Flip Chip bonding
更新于2025-09-16 10:30:52
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P‐9.3: The representation of monochromatic blue Micro‐LED arrays with 1984 ppi
摘要： Blue InGaN/GaN Micro-LED arrays based on silicon and sapphire substrates were fabricated respectively. The LED chips with 12.8 μm pixel pitch share a common n contactor in a 960*540 LED array. The driving current for a single LED chip with 8 μm mesa reaches as large as 20 mA, which indicates its current density is much larger than that of LEDs even in high power lighting application. Meanwhile, the reverse leakage current of a single 8μm size LED chip under -5V bias is below 10 pA, which falls within the range of a normal leakage current level for InGaN/GaN LED. The heat pressing bonding process between LED array and test backplane was also carried out for I-V-L test. The test results of LED arrays were presented.
关键词： Micro display,Flip-chip bonding,Micro-LED
更新于2025-09-12 10:27:22
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Flip-Chip Bonding Fabrication Technique
摘要： Military systems, outer space exploration and even in medical diagnosis and treatment used magnetic field detection. Low magnetic field detection is particularly important in tracking of magnetic. Traditional magnetometer tends to be bulky that hinders its inclusion into micro-scaled environment. This concern has brought the magnetometer into the trend of device miniaturization. Miniaturized magnetometer is usually fabricated using conventional microfabrication method particularly surface micromachining in which micro structures are built level by level starting from the surface of substrates upwards until completion of final structure. Although the miniaturization of magnetometer has been widely researched and studied, the process however is not. Thus, the process governing the fabrication technique is studied in this paper. Conventional method of fabrication is known as surface micromachining. Besides time consuming, this method requires many consecutive steps in fabrication process and careful alignment of patterns on every layer which increase the complexity. Hence, studies are done to improve time consuming and reliability of the microfabrication process. The objective of this research includes designing micro scale magnetometer and complete device fabrication processes. A micro-scale search coil magnetometer of 15 windings with 600μm thickness of wire and 300μm distance between each wire has been designed.
关键词： Surface Micromachining,Fabrication Technique,Micro magnetometer,Flip-Chip Bonding
更新于2025-09-09 09:28:46
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An X-ray TES Detector Head Assembly for a STEM–EDS System and Its Performance
摘要： A detector head for an energy-dispersive X-ray spectroscopy (EDS) for a scanning transmission electron microscope (STEM) was designed, fabricated, and tested. A 64-pixel TES X-ray microcalorimeter and 64 SQUID array amplifiers (SAAs) are mounted on a detector head which is cooled to about 100 mK. The body of the detector head is a copper rod of about 1 cm2 cross section and 10 cm length with 3 cm cubic structure at the bottom. The TES microcalorimeter is mounted at the top of the rod while the SAAs are mounted on the four side surfaces of the cubic structure. In order to reduce the number of wire bondings, we adopted a flip-chip bonding for the SAAs. In order to reduce the stress imposed on the flip-chip bondings due to the difference in the linear thermal expansion of the SAA chip and the mounting surfaces, we mounted the SAAs and connectors to the room-temperature electronics on sapphire circuit board and mounted the SAAs and connectors using a superconducting flip-chip bonding technology. Then, both the TES and the sapphire circuit board were mounted on the rod and are connected to the print circuit like superconducting wires, which are created on the multiple surfaces of the rod, with Al wire bondings. We reduced the number of wire bondings from 768 to 256. The yield of the flip-chip bonding was not perfect but relatively high. We installed the detector head in the STEM EDS system, confirmed that the energy resolution and counting requirements, (cid:2)E < 10 eV with 5 kcps were fulfilled.
关键词： EDS,TES,Superconducting flip-chip bonding,STEM
更新于2025-09-04 15:30:14