- 标题
- 摘要
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- 实验方案
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Laser cladding with grinding processing of orthogonal offset face gear
摘要： To further develop the advantages of face gear drives and improve their anti-sticking performance and wear resistance, a novel method using laser cladding as the primary process is proposed; here, grinding processing is used as the secondary process, i.e., achieving tooth surface strengthening of the orthogonal offset face gear using two types of materials to form a material gradient based on a laser cladding technology. Then, grinding processing is performed using a five-axis grinding machining. First, according to the forming principle of the face gear tooth surface, we establish the coordinate system of the orthogonal offset face gear and the gear cutter coordinate system; we also derive the tooth surface equation of the virtual gear cutter and the tooth surface equation of the orthogonal offset face gear. Second, we research the principles of the laser cladding and establish a laser cladding test bed for the orthogonal offset face gear. Based on the analysis of the design of the cladding layer and the process parameters of the face gear, the selection of the scanning path, the heat accumulation during the laser cladding process, and the accuracy control of the scanning position, we perform a laser cladding experiment on the offset orthogonal face gear. Third, we establish the machining coordinate system of the face gear based on the machine tool structure and conduct a grinding experiment for the face gear after the cladding process. Finally, we analyze the morphology and hardness of the face gear after grinding. A bench test verification of the axle face gear transmission system is completed. The results show that the precision and surface hardness of the tooth surface are significantly improved after grinding. Meanwhile, the accuracy and feasibility of the laser cladding surface of the face gear are verified.
关键词： Laser cladding,Generating grinding,Surface strengthening,Five-axis grinding machine,Face gear
更新于2025-11-28 14:24:20
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Methodology and implementation of a vision-oriented open CNC system for profile grinding
摘要： CNC systems with the vision function have become very valuable for intelligence machine tools because machine vision is a fast-growing intelligent feature for machines. A novel vision-oriented open CNC system was developed in this study and used in profile grinding machines for the precise machining of parts with contour surfaces, such as complex molds and cutting tools. The system is an innovation to the conventional profile grinding method and enabled the profile error to be visually detected and compensated during the machining process. In this study, a novel design methodology for a machine-vision-oriented CNC system was proposed. An Ethernet-based hardware architecture was constructed for the vision-oriented CNC system. The software characteristics of the developed CNC system were analyzed, including a new type of multi-thread software architecture, a seamless handover approach for multi-thread accessing of the memory space, the integration of the human-machine interface with image processing, and virtual-axis-based online error compensation. The running efficiency test of the software development platforms, time-consumption analysis of the measurement and control in the vision-oriented CNC system, and verification of the effectiveness of the developed vision-oriented CNC system were performed. The results indicate that the proposed vision-oriented open CNC system can effectively fuse image processing with motion control, meet the efficiency requirement, and improve the machining precision of profile grinding. The results are also valuable for developing other machine-vision-based intelligent machine tools.
关键词： Contour error,Profile grinding,Image processing,On-machine measurement,Open CNC,Machine vision
更新于2025-09-23 15:23:52
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Estimation of Energy and Time Savings in Optical Glass Manufacturing When Using Ultrasonic Vibration-Assisted Grinding
摘要： Energy and time savings are highly important aspects of green manufacturing. Ultrasonic vibration-assisted grinding (UVAG) is a high-efficiency, low-energy-consumption processing method for optical components made from hard and brittle materials. This work presents an experimental investigation of the specific grinding energy and the subsurface damage depth in UVAG of optical glasses to estimate the increased energy and time savings produced when using UVAG in optical glass manufacturing. The normal and tangential grinding forces of traditional grinding (TG) and axial UVAG processes on optical glasses were investigated for various machining parameters. The specific grinding energies during the TG and UVAG of the optical glasses were calculated and analyzed from the perspective of the energy consumption of the grinding process. The subsurface damage depths in optical glass during TG and UVAG were measured as an estimate of the machining quality, and the magnetorheological polishing spot method was used to analyze the time saved in subsequent polishing processes. The results show that UVAG can reduce energy consumption during the grinding of glass and produce significant time savings in subsequent polishing processes. The UVAG process therefore shows good potential for use in green manufacturing of optical components.
关键词： Energy saving,Sub-surface damage,Ultrasonic vibration-assisted grinding,Specific grinding energy
更新于2025-09-23 15:22:29
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Generation and distribution of residual stress during nano-grinding of monocrystalline silicon
摘要： Residual stress generated in grinding process of monocrystalline silicon can cause the wafer warpage, and di?culties in subsequent processes such as holding and scribing. It can also lead to the formation of cracks and the occurrence of corrosion, which is harmful for electrical performance of silicon component. In this study, with the method of step-wire wet etching, the phase transformation and distribution of residual stress in ground silicon wafer were examined by confocal laser micro-Raman spectroscopy. As the etching depth going down, the residual stress exhibits in the trends of decreasing of compressive stress and following a scatter distribution of tensile stress. During the nano-grinding processes of monocrystalline silicon, the generation mechanism of residual stress is computed by a series of the molecular dynamic (MD) simulation. Subsurface damage (SSD) in the form of phase-transformed silicon is observed, and the depth of SSD varies by the depth of cut. The volume shrinkage of phase-transformed silicon is also studied to explain the grinding mechanism and the reason for inducing residual stress of ground silicon. By adopted the Stony theory and volume shrinkage rate of amorphous phase from MD results, a theoretical model is established to determine the trend of compressive stress in subsurface of ground silicon.
关键词： monocrystalline silicon,residual stress,nano-grinding,phase transformation,molecular dynamics
更新于2025-09-23 15:21:21
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Study on non-isothermal hot-embossing of polymer micro-prism array with efficiency and accuracy
摘要： The isothermal hot-embossing leads to inefficiency because of heating and cooling whole polymer workpiece for precision micro-forming. Hence, a non-isothermal hot-embossing is proposed by compressing and melting a micron-scale surface layer into heated core microgrooves without changing the solid-state workpiece. The objective is to understand how the upper layer micro-prism array is formed on large-size polymer surface with regard to core microgroove parameters and hot-embossing variables. First, the micro-prism shape and sizes were in-process modeled through a hybrid of mechanical compression and hot-melt flowing inside core microgrooves; then the micro-grinding with the trued wheel micro-tip was employed to fabricate various microgrooves on macro-size die cores; finally, the micro-forming accuracy and efficiency were experimentally investigated in hot-embossing. It is shown that the integrated micro-prism array with nanometer-scale surface roughness is rapidly generated inside accurate and smooth core microgrooves with 1-3 seconds. The micro-forming accuracy is dominated by the hot-embossing variables under the limitations of core microgroove parameters. Moreover, the hot-embossed surface roughness reaches 10-30 nm through the hot-melt layer flowing even if the core surface roughness is larger. It is confirmed that the rapid micro-forming sizes and surface roughness may be predicted by the micro-nano core topographies and the hot-embossing variables.
关键词： micro-forming,die core,micro-grinding,hot-embossing,LGP,micro-prism array
更新于2025-09-23 15:21:21
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Deformation and removal of semiconductor and laser single crystals at extremely small scales
摘要： Semiconductor and laser single crystals are usually brittle and hard, which need to be ground to have satisfactory surface integrity and dimensional precision prior to their applications. Improvement of the surface integrity of a ground crystal can shorten the time of a subsequent polishing process, thus reducing the manufacturing cost. The development of cost-effective grinding technologies for those crystals requires an in-depth understanding of their deformation and removal mechanisms. As a result, a great deal of research efforts were directed towards studying this topic in the past two or three decades. In this review, we aimed to summarize the deformation and removal characteristics of representative semiconductor and laser single crystals in accordance with the scale of mechanical loading, especially at extremely small scales. Their removal mechanisms were critically examined based on the evidence obtained from high-resolution TEM analyses. The relationships between machining conditions and removal behaviors were discussed to provide a guidance for further advancing of the grinding technologies for those crystals.
关键词： semiconductor,laser crystal,deformation and removal,transmission electron microscopy (TEM),grinding
更新于2025-09-23 15:21:01
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Rotating Angle Error Influence to Grinding Aspheric Optical Component
摘要： An analyzing rotating error method has presented based on grinding aspheric optical component. A coordinate transform has been done between the new and original coordinates system in view of the rotating error in installing parts, further, the rotating angle error model has deduced between actual curve and theoretical curve. The surface error formulas can be used for variety of rotary conic aspheric curve, depending on the requirements of the parts surface accuracy, quantitative adjustment target can be given in installation and adjustment process before grinding. Based on the rotating error formulas, the calculating example shows that installation angle bas various different influence to surface shape error, the error decreases with the θ decreasing, the surface error is reduced a magnitude accordingly when the angle is reduced to a magnitude. The parts surface error is up from -0.0030mm to -0.0448mm when the rotating angle increasing from 0.1° to 1°. When θ is constant, the surface shape error increases with steepness increasing, installing rotating angle requirement is more stringent for all the large steepness parts.
关键词： Aspheric Surface,Profile Precision,Grinding,Rotating error
更新于2025-09-23 15:21:01
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Realization of high efficiency and low damage machining of anisotropic KDP crystal by grinding
摘要： Potassium dihydrogen phosphate (KDP) is a non-linear material used in various opto-electronic applications including Q-switches, high-speed photography shutters, frequency harmonic generation lens and Pockels cells in the Inertial Confinement Fusion (ICF) devices. KDP belongs to the most difficult-to-cut material, due to its delicate and unique characteristics including the combination of softness with brittleness, anisotropic performances, tendency for deliquescence and sensitivity to temperature change. Single point diamond turning (SPDT) is considered to be the ideal method for machining KDP components. However, the process efficiency is rather low and often accompanied with severe tool wear issues. This paper studies the feasibility using grinding method to remove the surface material of KDP components with high process efficiency and low damage, fulfilling the task of re-aligning the surface orientation to the crystalline axis. The grinding tests were carried out on a common CNC grinder, using resin bonded diamond grinding wheel, whilst the diamond abrasives are coated with Ni-P alloy. The direction of precision grinding was determined by studying the anisotropy of KDP, including its elastic modulus E, Vickers hardness HV and fracture toughness KIC, to reduce the influence of material anisotropy on machining quality. The grinding process parameters were preliminarily determined based on the experimental results investigating the effects of peripheral speed of the grinding wheel, worktable feed rate and grinding depth on the ground surface roughness. The surface defects, surface morphology and sub-surface damage under different process parameters were investigated. Surface roughness Ra ≤ 0.3μm and sub-surface damage depth SSD ≤ 6μm were obtained. The machining efficiency can be improved by nearly ten times using the proposed precision grinding method, producing nearly the same surface quality (Ra ≤ 0.2μm, SSD ≤ 6μm) as that in the axis fixing phase in SPDT.
关键词： KDP crystal,Crystal axis fixing,Machining efficiency,Sub-surface damage,Grinding,Typical impurities embedded
更新于2025-09-23 15:21:01
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Post-annealed graphite carbon nitride nanoplates obtained by sugar-assisted exfoliation with improved visible-light photocatalytic performance
摘要： Two-dimensional (2D) graphitic carbon nitride (g-C3N4) nanoplates (CNNP) have become a hot research topic in photocatalysis due to their small thickness and large specific surface area that favors charge transport and catalytic surface reactions. However, the wide application of 2D g-C3N4 nanoplates prepared by ordinary methods suffers from increased band gaps with a poor solar harvesting capability caused by the strong quantum confinement effect and reduced conjugation distance. In this paper, a facile approach of exfoliation and the following fast thermal treatment of the bulk g-C3N4 is proposed to obtain a porous few-layered g-C3N4 with nitrogen defects. Due to the preferable crystal, textural, optical and electronic structures, the as-obtained porous CNNP demonstrated a significantly improved photocatalytic activity towards water splitting than the bulk g-C3N4 and even the 3 nm-thick CNNP obtained by sugar-assisted exfoliation of the bulk g-C3N4. The difference in the enhancement factors between the H2O splitting and organic decomposition has revealed the effect of N defects. This study offers insightful outlooks on the scalable fabrication of a porous few-layered structure with a promoted photocatalytic performance.
关键词： Photocatalytic activity,g-C3N4 nanoplates,Co-grinding,Thermal treatment,Sugar
更新于2025-09-23 15:19:57
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Study on process and manufacturability of metal-bonded diamond grinding wheel fabricated by selective laser melting (SLM)
摘要： Selective laser melting (SLM) technology is used to fabricate metal-bonded grinding wheel based on mixed powders consisted of metal powders and diamond abrasives. Taguchi method is adopted to obtain the optimal SLM process parameters for grinding wheel considering laser power, scanning speed and layer thickness. Specimens are fabricated with different SLM process parameters for compression and three-point bending tests. Materials characterization and manufacturing limit test are performed on the specimens fabricated by the optimal SLM process. Results indicate that laser power of 250W, scanning speed of 2.5m/s and layer thickness of 20μm are determined as the optimal SLM process in terms of comprehensive mechanical property and formed surface quality. Moreover, diamond abrasives are firmly embedded into aluminium binder with good bonding condition for SLM-fabricated composite. Furthermore, manufacturability of SLM-fabricated composite is evaluated by manufacturing limits of several common structures. In summary, work in this study fully proves the feasibility of SLM-fabricated metal-bonded grinding wheel and provides a solid basis for the further investigation on the novel grinding wheel with customized porous structures.
关键词： diamond abrasives,metal-bonded grinding wheel,manufacturability,Taguchi method,Selective laser melting (SLM)
更新于2025-09-23 15:19:57