- 标题
- 摘要
- 关键词
- 实验方案
- 产品
-
[IEEE 2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) - Xi'an, China (2019.6.12-2019.6.14)] 2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) - Polarization measurement method of semiconductor laser
摘要： A high-density low-power parallel I/O for die-to-die communication is presented. The proposed interface includes a low-power transceiver and a high-density low-cost silicon interposer. The link architecture exploits single-sided and capacitive termination, passive equalization in the transmitter, and CMOS logic-style circuits to reduce the power consumption. To achieve a high bump/wire efficiency, single-ended signaling is used. A 4-layer Aluminum silicon interposer is fabricated providing 2.5 mm and 3.5 mm links between prototype transceivers. The transceiver prototype includes 3 transmitters and 3 receivers fabricated in 28 nm STM FD-SOI CMOS technology. The parallel interface operates at 20 Gb/s/wire and 18 Gb/s/wire data rates over the 2.5 mm and 3.5 mm channels with 5.9 and 7.7 dB of loss relative to DC (10.7 and 13.5 dB total loss) at while consuming 0.30 and 0.32 pJ/bit excluding clocking circuits, respectively.
关键词： Chip-to-chip communication,high-speed I/O,silicon Interposer,die-to-die communication,termination,single-ended signaling,passive equalizer,low-power transceivers
更新于2025-09-19 17:13:59
-
Terahertz topological photonics for on-chip communication
摘要： The realization of integrated, low-cost and efficient solutions for high-speed, on-chip communication requires terahertz-frequency waveguides and has great potential for information and communication technologies, including sixth-generation (6G) wireless communication, terahertz integrated circuits, and interconnects for intrachip and interchip communication. However, conventional approaches to terahertz waveguiding suffer from sensitivity to defects and sharp bends. Here, building on the topological phase of light, we experimentally demonstrate robust terahertz topological valley transport through several sharp bends on the all-silicon chip. The valley kink states are excellent information carriers owing to their robustness, single-mode propagation and linear dispersion. By leveraging such states, we demonstrate error-free communication through a highly twisted domain wall at an unprecedented data transfer rate (exceeding ten gigabits per second) that enables real-time transmission of uncompressed 4K high-definition video (that is, with a horizontal display resolution of approximately 4,000 pixels). Terahertz communication with topological devices opens a route towards terabit-per-second datalinks that could enable artificial intelligence and cloud-based technologies, including autonomous driving, healthcare, precision manufacturing and holographic communication.
关键词： topological photonics,silicon chip,valley kink states,on-chip communication,terahertz
更新于2025-09-19 17:13:59
-
Metamaterials - Devices and Applications || Development of Metamaterial EBG Absorbers for Application of Wireless Inter/Intrachip Communication Systems
摘要： First, the chapter presents a novel design of electromagnetic bandgap (EBG) absorber with the characteristics of broad bandwidth, low profile, and polarization‐independence to a normal incident electromagnetic wave. The absorber is composed of three consecutive octagon or decagon loops, and highly‐resistive frequency selective surface (FSS) layers. Second, based on the feature of the designed absorber unit, a broadband, meta‐material absorber‐bounded, wireless inter/intrachip (WIIC) communication channel is constructed at the center frequency of 60 GHz. Third, in order to validate the developed methodology used in WIIC analysis, a wired channel on a conventional PCB has been measured, simulated, and analyzed. Fourth, with the extracted S‐parameters of the WIIC system and wired PCB channel, the system impulse responses and transfer functions of the investigated channels have been further extracted, which are used for validation and BER analysis of the WIIC system. Finally, it has been shown that based on the derived BER results, the performance of the designed WIIC channel is close to that of an additive Gaussian white noise (AWGN) channel when the WIIC transceivers are built in with the functionalities of forward error control (FEC), channel estimation, and equalization.
关键词： metamaterial EBG,channel design,absorber,wireless inter/intra chip communication,bit error rate
更新于2025-09-09 09:28:46