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Universal Testing Apparatus Implementing Various Repetitive Mechanical Deformations to Evaluate the Reliability of Flexible Electronic Devices
摘要： A requirement of flexible electronic devices is that they maintain their electrical performance during and after repetitive mechanical deformation. Accordingly, in this study, a universal test apparatus is developed for in-situ electrical conductivity measurements for flexible electrodes that are capable of applying various mechanical deformations such as bending, twisting, shearing, sliding, stretching, and complex modes consisting of two simultaneous deformations. A novel method of deforming the specimen in an arc to induce uniform bending stress in single and alternating directions is also proposed with a mathematically derived control method. As an example of the arc bending method, the changes in the resistance of the printed radio frequency identification (RFID) tag antennas were measured by applying repetitive inner bending, outer bending, and alternating inner-outer bending. After 5000 cycles, the increases in resistance of the specimens that were subjected to inner or outer bending only were under 30%; however, specimens that were subjected to alternating inner-outer bending showed an increase of 135% in resistance. It is critical that the reliability of flexible electronic devices under various mechanical deformations be determined before they can be commercialized. The proposed testing apparatus can readily provide various deformations that will be useful to inform the design of device shapes and structures to accommodate deformations during use.
关键词： mechanical deformation,printed electronics,reliability,test apparatus,flexible electronics
更新于2025-09-23 15:22:29
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Investigation of Electrical Properties and Reliability of GaN-Based Micro-LEDs
摘要： In this paper, we report high-performance Micro-LEDs on sapphire substrates, with pixel size scaling to 20 μm and an ultra-high current density of 9902 A/cm2. The forward voltages (VF) of the devices ranged from 2.32 V to 2.39 V under an injection current density of 10 A/cm2. The size and structure-dependent effects were subsequently investigated to optimize the device design. The reliability of Micro-LED devices was evaluated under long-aging, high-temperature, and high-humidity conditions. It was found that Micro-LED devices can maintain comparable performance with an emission wavelength of about 445 nm and a full width at half maximum (FWHM) of 22 nm under extreme environments. Following this, specific analysis with four detailed factors of forward voltage, forward current, slope, and leakage current was carried out in order to show the influence of the different environments on different aspects of the devices.
关键词： GaN-based micro-LEDs,micro-LED display,reliability test
更新于2025-09-19 17:13:59
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An Effective Method On Evaluating Photovoltaic Module Snail Trail
摘要： Although in recent years photovoltaic module snail trails have been extensively studied, when it comes to development of photovoltaic modules, it remains difficult to find the suitable method to evaluate what materials cause snail trails. The key is how to make the sample suitable for test so that it can generate snail trials. This paper intends to solve this problem and determine suitable test conditions to accelerate the occurrence of snail trails. An experimental comparison is also made to evaluate different test samples made with different combinations of materials.
关键词： snail trails,module reliability test,Snail trail,PV module defects
更新于2025-09-12 10:27:22