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[IEEE 2018 31st International Vacuum Nanoelectronics Conference (IVNC) - Kyoto, Japan (2018.7.9-2018.7.13)] 2018 31st International Vacuum Nanoelectronics Conference (IVNC) - Field Emission from n-Type Si Surface Sandblasted by Al<inf>2</inf>O<inf>3</inf> Fine Particles
摘要： An efficient silicon field emitter was fabricated by a simple sandblasting technique using Al2O3 fine particles. The fabricated rough structure worked well as an efficient field emitter. As the average emission current increased, the fluctuation ratio of the emission current decreased. The Si field emitters exhibited excellent emission-current stability in both long-term drift and short-term fluctuation.
关键词： finely nicked structure,silicon,sandblast
更新于2025-09-23 15:21:21
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An Investigation of Processes for Glass Micromachining
摘要： This paper presents processes for glass micromachining, including sandblast, wet etching, reactive ion etching (RIE), and glass reflow techniques. The advantages as well as disadvantages of each method are presented and discussed in light of the experiments. Sandblast and wet etching techniques are simple processes but face difficulties in small and high-aspect-ratio structures. A sandblasted 2 cm × 2 cm Tempax glass wafer with an etching depth of approximately 150 μm is demonstrated. The Tempax glass structure with an etching depth and sides of approximately 20 μm was observed via the wet etching process. The most important aspect of this work was to develop RIE and glass reflow techniques. The current challenges of these methods are addressed here. Deep Tempax glass pillars having a smooth surface, vertical shapes, and a high aspect ratio of 10 with 1-μm-diameter glass pillars, a 2-μm pitch, and a 10-μm etched depth were achieved via the RIE technique. Through-silicon wafer interconnects, embedded inside the Tempax glass, are successfully demonstrated via the glass reflow technique. Glass reflow into large cavities (larger than 100 μm), a micro-trench (0.8-μm wide trench), and a micro-capillary (1-μm diameter) are investigated. An additional optimization of process flow was performed for glass penetration into micro-scale patterns.
关键词： reactive ion etching,wet etching,sandblast,glass reflow process,glass micromachining
更新于2025-09-10 09:29:36