- 标题
- 摘要
- 关键词
- 实验方案
- 产品
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Surface Planarization of Low-Temperature Flowable Silicon Oxide for Atomic Layer Deposition Al <sub/>2</sub> O <sub/>3</sub> Thin Film Encapsulation
摘要： In this research, a flowable chemical vapor deposition (FCVD) process was developed to planarize particle-scattered surfaces for thin film encapsulation by atomic layer deposition (ALD). Nanometer-thick ALD layers are known to have good barrier properties owing to the conformal deposition of the films and their high density, but those barrier properties are vulnerable to degradation because of surface particles on the substrates. In this study, FCVD silicon oxide layer was applied to particle-scattered surfaces as a planarization interlayer. Flowable silicon oxide thin films were deposited with tetrabutoxysilane and O2 in an inductively coupled plasmas reactor. The chemical bonding structure of the flowable silicon oxide was verified with Fourier transform infrared spectroscopy. To confirm the planarization effect, particles 2 μm in diameter were intentionally spread on the substrates by electrospray processing and nanometer-thick Al2O3 layers were deposited on top of the planarization interlayers. With the flowable silicon oxide interlayer and the same particle density on flexible substrates, the water vapor transmission rate was reduced to 1.2 × 10?3 g/(m2 · day) from 2.0 × 10?3 g/(m2 · day). The flowable silicon oxide layers are thus demonstrated to be effective interlayers to reduce the influence of particle contamination for ALD barrier films.
关键词： Thin Film Encapsulation,Planarization Effect,Flowable Chemical Vapor Deposition
更新于2025-09-23 15:22:29
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A review of highly reliable flexible encapsulation technologies towards rollable and foldable OLEDs
摘要： As the demand for flexible, rollable, and foldable displays grows, various state-of-the-art component technologies, including thin-film transistors (TFTs), electrodes, thin-film encapsulations (TFEs), and touch screen panels, have been developed based on organic light-emitting diodes (OLEDs) with flexible organic layers. Developing highly reliable flexible OLEDs is essential to realize flexible displays, but the flexible encapsulation technology still has technical difficulties and issues to be addressed. This review covers the recent developments in encapsulation technologies, particularly their material and structural designs, for highly reliable, flexible OLEDs. The solution concepts for the existing technical hurdles in flexible encapsulations are addressed. Among the various advanced flexible encapsulation technologies developed so far, neutral-axis engineering with a thin metal layer and a crack arrester is introduced.
关键词： organic light-emitting diode (OLED),Thin-film encapsulation (TFE),foldable,flexible,rollable
更新于2025-09-16 10:30:52
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Thin film encapsulation for the organic light-emitting diodes display via atomic layer deposition
摘要： Organic light-emitting diodes (OLEDs) have aroused great attention due to the advantages of high luminescent efficiency, fast response time, wide viewing angle, and the compatibility with the flexible electronics. Nevertheless, the organic luminescent materials are vulnerable to environment moisture/oxygen. Thus, how to protect the OLEDs from the ambient moisture/oxygen erosion is of great importance to ensure the stability and reliability. Thin film encapsulation (TFE) via atomic layer deposition (ALD) has emerged as a potential method to meet the encapsulation requirements of OLEDs due to its unique assets. In this review, the challenges of TFE, including pinholes, crystallization, cracks, and overheated, are introduced first. The ALD-based monolayer, composite structures, and hybrid laminates were developed to improve the barrier property, flexibility, and thermal conductivity. Besides, the ALD reactors and processes for TFE are also reviewed. Finally, the challenges remained and future development in the stabilization of OLEDs via ALD are also discussed.
关键词： flexible electronics,moisture barrier,OLED,thin film encapsulation,atomic layer deposition
更新于2025-09-16 10:30:52
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3.4: Applications of TFE mask‐less technology for foldable AMOLED displays
摘要： Thin-film encapsulation (TFE) for foldable AMOLED display is necessary to have good reliability and excellent bendability. TFE mask induces particles easily and crack occurs in thick TFE layer during panel bending. We developed TFE with Al2O3 layer for high water-proof and very thin thickness, satisfying the requirement of reliability and bendability. The Al2O3 layer in TFE structure was deposited by low temperature atomic layer deposition (ALD) method，and we realized TFE mask-less process through adapting dry-etch parameters for Al2O3 etch, finding that BCl3 has very excellent dry-etch selectivity between inorganic layer (SiOx/SiNx/SiOxNy) and Al2O3. Besides, we also attempted to make the organic layer of TFE acted as etch mask, and it proved to be feasible, indicating that all the TFE masks could be taken out effectively. Moreover, we proved good optic and reliability characteristics of AMOLED display with mask-less TFE structure.
关键词： Atomic Layer Deposition (ALD),mask-less,Thin-Film Encapsulation (TFE),AMOLED
更新于2025-09-11 14:15:04
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32.2: Multifunctional electrohydrodynamic printing and its industrial applications in flat panel display manufacturing
摘要： Inkjet printing has become a robust, effective and powerful technique for display manufacturing due to its compatibility with large-area substrates, and cost effectiveness. However, conventional thermal or piezoelectric actuation falls short to fabricate the high-resolution components, and is inapplicable to highly viscous materials. Electrohydrodynamic (EHD) printing, which adopts electrical field force to pull the fluid flow from the Taylor cone at the nozzle, exhibits the ultra-high resolution (even to the nanoscale) and excellent compatibility with highly viscous inks. This paper has presented the promising applications of EHD printing in display manufacturing, e.g. micro dams for boundary definition, organic thin films for encapsulation, and micro lens array for light extraction. Dams with width/thickness of 1~20 μm/0.5~3 μm have been directly written on test element group border in a cost-effective and high-efficient manner, to replace traditional lithography and etching process in boundary definition. By adopting EHD printing to eject smaller droplets, the thickness of the organic layer in thin film encapsulation has been decreased to less than 6 μm, which is far beyond the current industrial level (8~12 μm), and making the device to be more flexible. Further, micro lens array with diameters ranging from 3 μm to 20 μm have been directly fabricated on the encapsulation layer of OLED, which make light outcoupling more effective.
关键词： electrohydrodynamic printing,micro lens,thin film encapsulation,dam
更新于2025-09-10 09:29:36
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P-10.2: The Influences of PECVD Deposition SiNx on the Thin Film Encapsulation Performance
摘要： Low-temperature PECVD technology was used to fabricated inorganic layer in thin film encapsulation for AMOLED display. We systematically obtained SiNx films in different RF power. Stress and refractive index was characterized and analyzed to study the film performance. The results shows that different RF power leads to different film stress, and well-designed stress-matched multilayer SiNx will highly improve the TFE reliability. Furthermore, the RA life time (60 °C, 90% RH) of OLED displays with new multilayer SiNx inorganic layer TFE structure has been sharply increased from 240hours to 480hours.
关键词： PECVD,SiNx,Thin Film Encapsulation,Flexible OLED
更新于2025-09-10 09:29:36