[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden, Germany (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - UV Assisted Chip-on-Wafer Direct Transfer Bonding (CoW DTB)

摘要： Chip-on-Wafer Direct Transfer Bonding (CoW DTB) technology employing a UV assisted chip transfer mechanism for the high-accuracy direct bonding application including III-V/Si, 2.5D/3D/Fan-Out integration was proposed. Basic experiments of the chip transfer process using the glass bond tool, which enables pressing the backside of the chips through the carrier sheet and UV irradiation to a UV peeling-type adhesive layer, were conducted. The experimental results show this novel process achieved stable chip transfer by optimizing the carrier sheet, glass bond tool design, and parameters such as UV irradiation intensity and time.