研究目的
Investigating the UV assisted Chip-on-Wafer Direct Transfer Bonding (CoW DTB) technology for high-accuracy direct bonding applications including III-V/Si, 2.5D/3D/Fan-Out integration.
研究成果
The proposed UV assisted CoW DTB technique offers a novel approach for high-accuracy bonding applications, including III-V/Si and 2.5D/3D/Fan-Out integration. The experimental results provide design guidelines for equipment/materials and highlight important parameters that need optimization for stable chip transfer. The process is expected to be applicable to a wide range of integration technologies requiring high-accuracy and high-density interconnect.
研究不足
The study identifies the need to control UV irradiation energy on the carrier sheet to achieve high quality and stability of the chip transfer process. The transparency of the carrier sheet and the design of the glass bond tool are critical factors that affect the efficiency of UV energy supply and the stability of the chip transfer process.
1：Experimental Design and Method Selection:
The study employs a UV assisted chip transfer mechanism for direct bonding applications. The methodology includes the use of a glass bond tool for pressing the backside of chips through a carrier sheet and UV irradiation to a UV peeling-type adhesive layer.
2：Sample Selection and Data Sources:
The experiments used Ar-plasma-treated 2 mm-square Si bare chips and a 3 inch-diameter Si bare wafer.
3：List of Experimental Equipment and Materials:
Equipment includes a UV illumination glass bond tool and two types of carrier sheets (A and B). Materials include a UV peeling-type adhesive sheet and a test sample developed for stealth dicing.
4：Experimental Procedures and Operational Workflow:
The process involves laminating a donor wafer to an adhesive sheet, dicing the wafer, transferring diced chips to a UV peeling-type adhesive sheet, aligning donor chips and acceptor wafer face-to-face, pressing the backside of the chips through the sheet with the glass bond tool, and UV irradiation to achieve bonding.
5：Data Analysis Methods:
The study evaluates chip transfer capability under various UV irradiation conditions and assesses the dependency on carrier sheet type, glass tool design, and UV irradiation condition.
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