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Structural and electrical properties of Pd/p-GaN contacts for GaN-based laser diodes
摘要： In this paper, the properties of Pd-based p-contacts on GaN-based laser diodes are discussed. Pd is often the metal of choice for ohmic contacts on p-GaN. However, for Pd/p-GaN ohmic contacts, nanovoids observed at the metal/semiconductor interface can have a negative impact on reliability and also reproducibility. The authors present a thorough analysis of the microstructure of the Pd/p-GaN interface by x-ray photoelectron spectroscopy (XPS) and scanning transmission electron microscopy (STEM). STEM data show that the microvoids at the p-GaN/Pd interface form during rapid thermal annealing. A combination of the following effects is suggested to support the void formation: (1) the differences in thermal expansion coefficients of the materials; (2) excess matrix or impurity atoms in the semiconductor, at the interface, and in the metals, which are released as gases; and (3) the strong antisurfactant effect of Pd on Ga-rich p-GaN surfaces. A slow temperature ramp during contact annealing reduces the formation of voids likely by suppressing the accumulation of gases at the interface. XPS data show that the Ga/N ratio can be reduced by suitable cleaning of the p-GaN surface, which enhances Pd adhesion. As a result, the quality of the contact system is improved by the systematic optimization of the surface cleanliness as well as the annealing parameters, leading to void-free and clean Pd/p-GaN interfaces. The specific contact resistance, extracted from linear transmission line method measurements, is reduced by an order of magnitude to 2 × 10?3 Ω cm2 at 1 mA for the same epitaxial layer stack.
关键词： Pd/p-GaN contacts,STEM,nanovoids,ohmic contacts,rapid thermal annealing,XPS,GaN-based laser diodes
更新于2025-09-23 15:21:01
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Electrophysical and Physical-Chemical Properties of Ohmic Contacts to III-N Compounds
摘要： Experimental data on studying ohmic contacts based on single-layer and multilayer metallizations on GaN and (In, Al, Ga)N solid solutions are analyzed. The contact resistance of the Ti/Al/Mo/Au and Ti/Al/Mo/W/Au metallizations on undoped GaN is studied. The dependences of the contact resistance on the GaN surface treatment before the metallization and on the metallization annealing regimes are investigated.
关键词： gallium nitride,surface treatment,(AlInGa)N solid solutions,ohmic contacts,metallization,charge neutrality level
更新于2025-09-19 17:15:36
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Band-energy estimation on silicon cap annealed 4H-SiC surface using hard X-ray photoelectron spectroscopy
摘要： Silicon-cap annealing (SiCA) emerged as a promising silicidation-less ohmic contact formation method that can solve the crucial reliability limitation of ohmic contacts formed with metals; this limitation was due to carbon aggregation introduced during silicidation annealing. However, no previous study for a complete understanding of SiCA effects on the metal/SiC exists. In this study, the band-energy state of silicidation-less ohmic contacts formed by SiCA-SiC is directly estimated using hard X-ray photoelectron spectroscopy (HAXPES). The results show that Si-dot formation on the SiC surface reduces the contacts resistivity, and ohmic contact behavior is still observed even after Si-dot removal. A peak position analysis of Si 1 s orbit using HAXPES shows a clear increase in the band energy under various SiC surface conditions. Particularly, the Al/SiCA-SiC sample shows a peak shift of 0.765 eV. This strong potential barrier lowering the derived formation of the thin-depletion layer and low potential barrier on Al/SiCA-SiC junction. Moreover, the observations made using HAXPES, and transmission electron microscopy, suggest that the modification of the outer-most surface layer plays an essential role in the ohmic contact formation. These results provide insights on the ohmic contact formation mechanism for wide-band-gap semiconductor materials.
关键词： 4H-SiC,silicidation-less ohmic contact,Ohmic contacts,silicon-cap annealing,Hard X-ray photoelectron spectroscopy
更新于2025-09-19 17:13:59
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Graphene based plasma-wave devices for terahertz applications
摘要： Unique properties of graphene are combined to enable graphene plasmonic devices that could revolutionize the terahertz (THz) electronic technology. A high value of the carrier mobility allows us to excite resonant plasma waves. The graphene bipolar nature allows for different mechanisms of plasma wave excitation. Graphene bilayer and multilayer structures make possible improved THz device configurations. The ability of graphene to form a high quality heterostructure with h-BN, black phosphorus, and other materials systems supports advanced heterostructure devices comprised of the best properties of graphene and other emerging materials. In particular, using black phosphorus compounds for cooling electron–hole plasma in graphene could dramatically improve the conditions for THz lasing. High optical phonon energy allows for reaching higher plasma frequencies that are supported by high sheet carrier densities in graphene. Recent improvements in graphene technology combined with a better understanding of the device physics of graphene THz plasmonics and graphene plasmonic device designs hold promise to make graphene THz plasmonic technology one of the key graphene applications. Commercialization of plasmonic graphene technology is facing the same challenges as other graphene applications, which have difficulties in producing uniform large graphene layers, bilayers, and heterostructures of high quality and making good low resistance stable Ohmic contacts. The time projection for large scale graphene electronic device applications now extends into the 2030s. However, emerging graphene mass production technologies might bring commercial applications of the graphene plasmonic terahertz technology closer.
关键词： heterostructures,graphene,black phosphorus,Ohmic contacts,plasma waves,THz technology,terahertz,plasmonic devices,optical phonon energy,carrier mobility
更新于2025-09-19 17:13:59
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Analytical model for accurate extraction of metal-semiconductor ohmic contact parameters using a novel electrode-pair layout scheme
摘要： In this paper, an electrode-pair model is proposed and demonstrated for the first time to accurately extract the electrical resistance parameters of the planar metal-semiconductor ohmic contacts. Different from the conventional transmission line model, the proposed model layout features a series of separated electrode pairs with the same electrode distance but various widths. Meanwhile, an equivalent circuit for contact resistance composition is set up to clearly specify the contribution of each resistance component to the overall contact performance. The semiconductor sheet resistances underneath the contact and outside the contact area are treated as completely independent variables. The proposed scheme is modeled theoretically and analyzed by the TCAD simulations, and the validity of the model is verified by the experimental data. Finally, the variance of the sheet resistance underneath the contact after annealing treatment can be distinguished by the model and hence more actual and precise specific contact resistance is achieved. This work provides a distinct perspective to understand and quantify the electrical characteristics of the semiconductor ohmic contacts, and it can also assist engineers for a better electrode layout design.
关键词： Ohmic contacts,Gallium Nitride,Semiconductor devices,Modeling process
更新于2025-09-10 09:29:36
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Gallium Oxide || Ohmic contacts to gallium oxide
摘要： The deposition of a metal onto a semiconductor surface to provide low contact resistance, high-reliability electrical contacts without adversely affecting the device during the metallization process is one of the most important challenges in device fabrication. Consequently, a fundamental understanding of how contacts work is essential for successful device manufacturing and commercialization. The physics of carrier transport across the metal-semiconductor junction renders metal contacts either rectifying (a.k.a. Schottky) or nonrectifying. A nonrectifying contact whose relationship between current and voltage has a low interfacial contact resistance Rc, and is preferably linear, is referred to as an Ohmic contact. Achieving low contact resistance Rc (Ω mm) or contact resistivity ρc (Ω cm2) has required a great amount of investigation for every relevant semiconductor material in the past. Typically, the successful formation of an Ohmic contact has relied on three constituent requirements: highly or degenerately doped semiconductor, choice of metallization, and thermal annealing. In the case of silicon, for instance, diffusion processes have been the topic of much early work but ultimately the control and reproducibility of ion implantation have rendered it an industry standard. For compound semiconductor heterostructure devices based on GaAs or GaN, the presence of a two-dimensional electron gas (2DEG) has necessitated a multilayer metallization deposition and annealing scheme, the details of which took many years to optimize. Particularly in the case of III-nitride high electron mobility transistors (HEMTs), Ohmic contacts were relatively easy to make on heteroepitaxal GaN due to its high dislocation density as the barrier height was reduced through defect-assisted formation of metal-nitride alloys during the anneal. Subsequent breakthroughs in GaN crystal growth, however, resulted in several orders of magnitude lower dislocation density homoepitaxial GaN, and naturally the contact resistance obtained under identical process conditions was higher [1]. Regrowth techniques to provide n+-doped GaN have become commonplace as a result.
关键词： thermal annealing,semiconductor,metallization,gallium oxide,contact resistance,Ohmic contacts
更新于2025-09-09 09:28:46
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Suppression of segregation of the phosphorus δ-doping layer in germanium by incorporation of carbon
摘要： The successful formation of abrupt phosphorus (P) δ-doping profiles in germanium (Ge) is reported. When the P δ-doping layers were grown by molecular beam epitaxy (MBE) directly on Ge wafers whose surfaces had residual carbon impurities, more than a half the phosphorus atoms were confined successfully within a few nm of the initial doping position even after the growth of Ge capping layers on the top. On the other hand, the same P layers grown on Ge buffer layers that had much less carbon showed significantly broadened P concentration profiles. Current–voltage characteristics of Au/Ti/Ge capping/P δ-doping/n-Ge structures having the abrupt P δ-doping layers with carbon assistance showed excellent ohmic behaviors when P doses were higher than 1 × 1014 cm?2 and the capping layer thickness was as thin as 5 nm. Therefore, the insertion of carbon around the P doping layer is a useful way of realizing ultrashallow junctions in Ge.
关键词： germanium,carbon incorporation,molecular beam epitaxy,ohmic contacts,phosphorus δ-doping
更新于2025-09-04 15:30:14