[IEEE 2018 IEEE Photonics Conference (IPC) - Reston, VA, USA (2018.9.30-2018.10.4)] 2018 IEEE Photonics Conference (IPC) - Low-Loss Wafer-Scale Silicon Photonic Interposer Utilizing Inverse-Taper Coupler

摘要： This paper experimentally demonstrates a low loss inter-chip coupler with coupling loss below 1dB utilizing inverse-taper coupling from a wafer scale silicon photonic interposer, designed to distribute laser emission to 100 photonic integrated circuit dies (PICs) with equal power and phase. During the packaging, PICs are flip-chip bounded onto the interposer to achieve electrical, optical, and thermal coupling.