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[IEEE 2020 Pan Pacific Microelectronics Symposium (Pan Pacific) - HI, USA (2020.2.10-2020.2.13)] 2020 Pan Pacific Microelectronics Symposium (Pan Pacific) - Qualification of NIR, UV and Laser Irradiation as Alternative Photonic Sintering Methods for Printed Electronics
摘要： Printed Electronics creates new areas of applications with a new manner of manufacturing electronics. Due to its technical and 3D design freedom, new markets and innovative products arise that were initially unthinkable. However, the focus of research is currently on mastering and improving the printing process. The subsequent process step of drying and densifying the printed structures to achieve high conductivities in the shortest possible time is up to now hardly considered. This paper treats the inquiry of fitted and optimized parameters of alternative promising photonic sintering methods for printed electronics compared to the much more time-intensive state of the art sintering process in a furnace. These photonic sintering methods comprise the near infrared, ultraviolet light as well as laser irradiation of the printed structures. Photonic sintering promises faster and more efficient curing and sintering due to the direct and selective application of energy to the printing structures without damaging the temperature-sensitive substrates. As substrate materials ABS and PC-ABS, as well as a glass material were used. Both polymer materials are standard and technical thermoplastics which are available at the market in huge quantities at low price. For the manufacture of printed circuits, a dispense printer was used, in order to process a low-cost silver-based micro particle paste. The evaluation of the sintering result was carried out based on the electrical conductivity of the printed conductor path and the adhesion strength on the substrate. In addition, the sintering time required for the curing of the structures as well as impacts on the substrate or the printed tracks due to photonic treatment were taken into account. To perform the experiments, two different print layouts were set up in order to be able to assess the electrical properties on the first layout and the adhesion on the second layout. To obtain a detailed statement on the exploration on the photonic sintering methods, a fully factorial design plan was conducted. For the near-infrared irradiation, the important parameters were the irradiation duration and the irradiation power. While sintered by ultraviolet light, the parameters were irradiation time, as well as the distance between the sample surface and the UV emitter. In the treatment by means of laser radiation, laser power and the motion speed were identified as the relevant parameters. In order to be able to draw a comparison to the mainly used sintering method, samples were also sintered in a furnace. The results show a significant reduction of the sintering time to a few seconds with comparable and even significantly better electrical and mechanical properties.
关键词： Printed Electronics,Polymer,Photonic Sintering,Conductivity,Alternative Sintering
更新于2025-09-23 15:21:01
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Ultrahigh Conductivity and Superior Interfacial Adhesion of a Nanostructured, Photonic Sintered Copper Membrane for Printed Flexible Hybrid Electronics
摘要： Inkjet-printed electronics using metal particles typically lack electrical conductivity and interfacial adhesion with an underlying substrate. To address the inherent issues of printed materials, this paper introduces advanced materials and processing methodologies. Enhanced adhesion of the inkjet-printed copper (Cu) on a flexible polyimide film is achieved by using a new surface modification technique, a nanostructured self-assembled monolayer (SAM) of (3-mercaptopropyl)trimethoxysilane. A standardized adhesion test reveals the superior adhesion strength (1192.27 N/m) of printed Cu on the polymer film, while maintaining extreme mechanical flexibility proven by 100,000 bending cycles. In addition to the increased adhesion, the nanostructured SAM treatment on printed Cu prevents formation of native oxide layers. Combined with newly synthesized Cu ink and associated sintering technique with an intense pulsed ultraviolet and visible light absorption, it enables ultrahigh conductivity of printed Cu (2.3 x 10-6 ??cm), which is the highest electrical conductivity reported to date. The comprehensive materials engineering technologies offer highly reliable printing of Cu patterns for immediate use in wearable flexible hybrid electronics. In vivo demonstration of printed, skin-conformal Cu electrodes indicates a very low skin-electrode impedance (< 50 k?) without a conductive gel and successfully measures three types of biopotentials, including electrocardiograms, electromyograms, and electrooculograms.
关键词： Photonic sintering,Printed Cu membrane,Enhanced conductivity,Interfacial adhesion,Flexible hybrid electronics
更新于2025-09-23 15:21:01
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Ultrafast Fabrication of Thermoelectric Films by Pulsed Light Sintering of Colloidal Nanoparticles on Flexible and Rigid Substrates
摘要： Sintered thermoelectric (TE) nanoparticle films are known to have a high figure-of-merit ZT factor and are considered for waste heat recovery and heating and cooling applications. The conventional process of thermal sintering of TE nanoparticles requires an inert environment and long heating times, and cannot be used on polymer substrates due to the requirements of the process (e.g., heating up to 400 °C). In this communication, the authors demonstrate for the first time the use of an intense flash of UV light from a Xenon lamp to sinter TE nanoparticles within milliseconds under ambient conditions on flexible polymer as well as glass substrates to create functional TE films. Photonic sintering is used to fabricate Bismuth Telluride thermoelectric films with a conductivity of 3200 S m?1 (a 5–6 orders of magnitude increase over unsintered films) and a peak power factor of 30 mW m?1 K?2. Modeling is used to gain an insight into the physical processes occurring during photonic sintering process and identify the critical parameters controlling the process. This work opens-up an exciting possibility of extremely rapid fabrication of TE generators under ambient conditions on a variety of flexible and rigid substrates.
关键词： power factor,ZT factor,thermoelectrics,Bi-Te nanoparticles,energy harvesting,photonic sintering
更新于2025-09-09 09:28:46
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Piezoelectric Property Enhancement of PZT Thick Film via Pulsed Flash Poling during Sintering
摘要： Lead zirconate titanate (PZT) is a widely used piezoelectric material due to its high piezoelectric response. High temperature thermal sintering and poling are two important steps to obtain a high piezoelectric property PZT film by densifying the film and reorienting the dipoles along the desired direction, respectively. However, these two steps are processed separately, which increases the duration and complexity of the process. Moreover, high temperature process limits the selection of electrode and substrate material to those with very high melting points. This paper experimentally demonstrates the feasibility of processing sintering and poling simultaneously providing a novel approach to prepare PZT film. Moreover, this paper investigates the effect of cyclic temperature excursions above and below the Curie temperature on the piezoelectric properties of PZT thick film. Photonic sintering with high intensity short duration pulsed flashes was used to fuse and merge PZT particles. Simultaneously, electrical poling field (20 kV/cm) was applied through the PZT film to reorient the PZT dipoles. The entire processing duration is less than 5 minutes. The resulted piezoelectric property of the PZT film was analyzed yielding high g33 (22.6 ×10-3 V-m/N), d33 (626 × 10-12 m/V), and permittivity (3130) indicating good sensing and actuating capabilities. This enhanced piezoelectric performance is superior to the groups of PZT films prepared using traditional process. This approach has potential applications for obtaining high performance piezoelectric devices, such as piezoelectric energy harvesters, memories, or bulk acoustic wave resonators.
关键词： piezoelectric,PZT,poling,photonic sintering,additive manufacturing,pulsed flash
更新于2025-09-04 15:30:14