研究目的
Investigating the use of alternative photonic sintering methods (NIR, UV, and laser irradiation) for printed electronics to achieve high conductivity and adhesive strength while reducing sintering time and temperature to avoid substrate damage.
研究成果
The study demonstrated that photonic sintering methods (NIR, UV, and laser irradiation) significantly reduce sintering time to a few seconds while achieving comparable or better electrical and mechanical properties than conventional furnace sintering. The methods were successfully adjusted based on the absorption characteristics of the substrates and silver paste, leading to improved conductivity and adhesion. These findings suggest that photonic sintering can enable faster production of printed electronics without compromising quality.
研究不足
The study focused on specific substrate materials (ABS, PC-ABS, and glass) and a silver-based micro particle paste. The applicability of the findings to other materials or printing processes was not explored. Additionally, the study did not investigate the long-term durability of the sintered structures.
1:Experimental Design and Method Selection:
The study employed a fully factorial design plan to explore the effects of different photonic sintering methods (NIR, UV, and laser irradiation) on printed electronics. The methods were chosen based on their potential to selectively apply energy to printed structures without damaging temperature-sensitive substrates.
2:Sample Selection and Data Sources:
Substrate materials included ABS, PC-ABS, and glass. A dispense printer was used to apply a low-cost silver-based micro particle paste onto these substrates.
3:List of Experimental Equipment and Materials:
Equipment included a 'Musashi Shotmaster 300' dispense printer, 'H?nle LED Cube 100 IC' for UV sintering, 'adphos NIR-96-250-E Module' for NIR sintering, and a Yb-fiber-laser for laser sintering. Materials included silver-based micro particle paste from Henkel.
4:Experimental Procedures and Operational Workflow:
Two different print layouts were used to assess electrical properties and adhesion. Parameters varied included irradiation duration and power for NIR, irradiation time and distance for UV, and laser power and motion speed for laser sintering.
5:Data Analysis Methods:
Electrical conductivity was measured using a 'Nanoohmmeter 20024' and a four-point measuring arrangement. Adhesion was evaluated through cross-cut tests and microscopic examination.
独家科研数据包,助您复现前沿成果,加速创新突破
获取完整内容