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Laser Patterning a Graphene Layer on a Ceramic Substrate for Sensor Applications
摘要： This paper describes a method for patterning the graphene layer and gold electrodes on a ceramic substrate using a Nd:YAG nanosecond fiber laser. The technique enables the processing of both layers and trimming of the sensor parameters. The main aim was to develop a technique for the effective and efficient shaping of both the sensory layer and the metallic electrodes. The laser shaping method is characterized by high speed and very good shape mapping, regardless of the complexity of the processing. Importantly, the technique enables the simultaneous shaping of both the graphene layer and Au electrodes in a direct process that does not require a complex and expensive masking process, and without damaging the ceramic substrate. Our results confirmed the effectiveness of the developed laser technology for shaping a graphene layer and Au electrodes. The ceramic substrate can be used in the construction of various types of sensors operating in a wide temperature range, especially the cryogenic range.
关键词： cryogenic,ceramic substrate,laser patterning,graphene
更新于2025-09-23 15:19:57
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[IEEE 2019 International Conference on Electronics Packaging (ICEP) - Niigata, Japan (2019.4.17-2019.4.20)] 2019 International Conference on Electronics Packaging (ICEP) - An Investigation of Compound Machining of Ceramic-LPM Package by Ultrafast Laser
摘要： It is well known that ceramic substrates provide excellent electrical insulation and protection from oxidation/ corrosion in addition to idea heat dissipation while allowing heat dissipation through controlled paths, e.g. integrated heat sinks. Low pressure molding (LPM) with polyamide and polyolefin (hot- melt) materials is a process typically used to injection molding for waterproof, to encapsulate and environmentally to protect electronic components. The purpose than epoxy encapsulation is to protect electronic components with finer pitch against moisture, dust dirt and vibration. There is a special need for SiP (System in Package) application utilizing both ceramic substrate and LPM package materials where ceramic serves as mechanical structure and thermal dissipation path and LPM for high density SMT (Surface Mount) package. The research of this paper is to apply nano UV (Ultraviolet) laser to machine the LPM and ceramic substrate (sapphire, Al2O3) and compare the results with nano green laser. The interactions of these two materials with laser are quite different and even conflicting for machining (LPM is ductile and hot-melt while ceramic is brittle), thus proper strategy has to be taken to satisfy needs for both materials. One of the major problem is the re-solidification of LPM material as temperature elevated during laser irradiation. It is necessary to provide a delay time between each laser pulsing. The laser ablation threshold (LAT) of green and UV laser for both materials is also investigated in this paper. The best parameters for processing ceramic substrates are speed 200 mm/s, frequency 95 kHz, delay time 450 ms, when processing LPM speed 700 mm/s, frequency 40 kHz, delay time 250 ms.
关键词： Low Pressure Mold (LPM) compound,laser ablation threshold (LAT),ceramic substrate,ultrafast Laser
更新于2025-09-11 14:15:04
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White LEDs With High Optical Consistency Packaged Using 3D Ceramic Substrate
摘要： Packaging efficiency and optical performances are important indexes for white light-emitting diodes (WLEDs) packaging. In this letter, wafer-level WLEDs packaging were presented by printing phosphor on three-dimensional (3D) ceramic substrate to improve packaging efficiency and optical consistency. The 3D ceramic substrate was prepared by repeatedly electroplating copper cups on the planar direct plated copper (DPC) ceramic substrate. The phosphor concentration was adjusted to realize natural white light. The fabrication errors of the 3D ceramic substrate and the optical performances of WLED modules were analyzed to evaluate the optical consistency of the WLED modules packaged by using 3D ceramic substrate. Consequently, the fabrication errors of 3D ceramic substrate are less than 1%. When the phosphor concentration was set at 12.5 wt%, the packaged LEDs achieve a natural white light with luminous efficiency (LE) of 94.55 lm/W, correlated color temperature (CCT) of 5915 K, and chromaticity coordinate of (0.3166, 0.3345). The WLED modules exhibit small standard deviations in LE (1%), color rendering index (1%), correlated color temperature (98 K), and high reliability. The results indicate that the WLEDs packaged using 3D ceramic substrate have excellent optical consistency.
关键词： direct plated copper (DPC) ceramic substrate,optical performance,White light-emitting diodes (WLEDs),LED packaging,reliability
更新于2025-09-11 14:15:04
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Experimental investigations on super-smooth polishing of strontium titanate based ceramics substrates
摘要： Strontium titanate (SrTiO3) is a new type of multi-function electronic ceramic material. SrTiO3 ceramic substrates with a high dielectric constant can be obtained by non-pressurised sintering using ultrathin blanks, which result in the characteristics of thin, soft, brittle and warped. So that SrTiO3 ceramics substrates need to be polished to improve surface quality and dimensional precision before application. In this research, polish experiments with various processing parameters on the surface roughness, the material removal rate and the surface morphologies of SrTiO3 ceramic substrates were conducted. The results show that the SrTiO3 ceramic substrate with a highest quality surface was obtained in the condition: employing a brown polyurethane pad to polish the substrates at a polishing velocity of 45 r/min. Meanwhile, the slurry flow rate, the concentration of the polishing slurry and the polishing pressure were 20 ml/min, 4 wt% and 15.043 kPa, respectively, which rates with an overall and a partial surface roughness of Ra 0.01 μm and Ra 4 nm, respectively. While some new micro-scratches were generated on the surface of the SrTiO3 ceramics substrate in the polishing process because the embedding and scratching of abrasive particle led to expose the inherent pores and grain boundaries.
关键词： ceramic substrate,material removal rate,strontium titanate,polishing,surface roughness
更新于2025-09-10 09:29:36