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Ultrahigh Conductivity and Superior Interfacial Adhesion of a Nanostructured, Photonic Sintered Copper Membrane for Printed Flexible Hybrid Electronics
摘要： Inkjet-printed electronics using metal particles typically lack electrical conductivity and interfacial adhesion with an underlying substrate. To address the inherent issues of printed materials, this paper introduces advanced materials and processing methodologies. Enhanced adhesion of the inkjet-printed copper (Cu) on a flexible polyimide film is achieved by using a new surface modification technique, a nanostructured self-assembled monolayer (SAM) of (3-mercaptopropyl)trimethoxysilane. A standardized adhesion test reveals the superior adhesion strength (1192.27 N/m) of printed Cu on the polymer film, while maintaining extreme mechanical flexibility proven by 100,000 bending cycles. In addition to the increased adhesion, the nanostructured SAM treatment on printed Cu prevents formation of native oxide layers. Combined with newly synthesized Cu ink and associated sintering technique with an intense pulsed ultraviolet and visible light absorption, it enables ultrahigh conductivity of printed Cu (2.3 x 10-6 ??cm), which is the highest electrical conductivity reported to date. The comprehensive materials engineering technologies offer highly reliable printing of Cu patterns for immediate use in wearable flexible hybrid electronics. In vivo demonstration of printed, skin-conformal Cu electrodes indicates a very low skin-electrode impedance (< 50 k?) without a conductive gel and successfully measures three types of biopotentials, including electrocardiograms, electromyograms, and electrooculograms.
关键词： Photonic sintering,Printed Cu membrane,Enhanced conductivity,Interfacial adhesion,Flexible hybrid electronics
更新于2025-09-23 15:21:01
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Self-assembled interface monolayers for organic and hybrid electronics
摘要： The state of the art in the field of self-assembled organic interface monolayers widely used in organic and hybrid electronics is analyzed and the results obtained are summarized. Recent advances in full and local substrate modification using interface layers are considered in detail. Examples of the most successful applications of interface monolayers as monolayer dielectrics, modifiers of the work function and adhesion promoters are given. The advantages of utilizing interface monolayers at semiconductor/dielectric interfaces and for modifying the semiconductor surface are demonstrated. Specific features of formation of nanostructured surfaces including those used in biosensoric applications are outlined.
关键词： adhesion promoters,work function modifiers,biosensors,organic electronics,interface layers,hybrid electronics,dielectrics,self-assembled monolayers
更新于2025-09-12 10:27:22
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[IEEE 48th European Solid-State Device Research Conference (ESSDERC 2018) - Dresden (2018.9.3-2018.9.6)] 2018 48th European Solid-State Device Research Conference (ESSDERC) - Low Profile Open MEMS and ASIC Packages manufactured by Flexible Hybrid Integration in a Roll-to-Roll compatible process
摘要： Here we report on a flexible, foil based packaging process in which a standard commercially available MEMS capacitive air pressure sensor is packaged in an “open package” configuration such that the sensitive membrane side of the MEMS is always in contact with the ambient atmosphere. Additionally, the matching ASIC chip to readout the MEMS sensor is integrated into the same package in a System-in-Foil (SiF) configuration. Here, both the MEMS and the ASIC wafers were thinned down to 250 μm, which resulted in a combined package height profile of < 0.5 mm. This foil based patch sensor has then been characterized in ambient air and its performance has been compared against a commercial MEMS (bare die) sensor available as standard Surface Mounted Device (SMD) component having a package height of 1 mm. The electrical performance and the functionality under thermal cycling and thermal shocks of these packaged sensors were found to be identical to the commercially available SMD variant. Furthermore, to demonstrate the applicability of such a thin, flexible foil sensor patch in the field of ?non-invasive“ air pressure measurements on planar and curved surfaces, these sensors were mounted onto the carrosserie of a car at different locations and the air pressure change due to the laminar / non-laminar flow of air (or air turbulence) over these control surfaces were measured. The results further verify the need for such low profile packaging such that the airflow over control surfaces can be measured without disturbing the laminar airflow. This opens up the application field of these packaged sensors for wind turbines, aircraft wings, skyscrapers/buildings and automotive applications.
关键词： System-in-Foil (SiF),Flexible Packaging,Chip-in-Foil (CiF),Flexible Hybrid Electronics (FHE),Roll-to-Roll (R2R)
更新于2025-09-09 09:28:46