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Reference Module in Materials Science and Materials Engineering || Wafer Bonding
摘要： Wafer bonding has been an important and critical technology in the development of micromachined sensors, actuators, microsystems, and their packaging for many decades. It is also being used in the fabrication of integrated circuits (ICs) and the formation of composite materials and wafers needed in advanced circuit technologies. Wafer, or die, bonding refers to the process whereby two or more wafers of similar or dissimilar materials are, often permanently, attached or bonded together. The individual wafers might have already been through previous fabrication steps to form various features on them, or might just be plain wafers.
关键词： Wafer Bonding,Microsystems,ICs,Packaging,MEMS
更新于2025-09-23 15:21:21
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[IEEE 2019 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD) - Ottawa, ON, Canada (2019.7.8-2019.7.12)] 2019 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD) - Simulation of Lateral Near- and Far-Field Profiles of Gain-Guided High-Power Semiconductor Lasers
摘要： The conversion of electrical to mechanical power on a sub-centimeter scale is a key technology in many microsystems and energy harvesting devices. In this paper, we present a type of a capacitive energy conversion device that uses capillary pressure and electrowetting to reversibly convert electrical power to hydraulic power. These microhydraulic actuators use a high surface-to-volume ratio to deliver high power at a relatively low voltage with an energy conversion efficiency of over 65%. The capillary pressure generated grows linearly with shrinking capillary diameter, as does the frequency of actuation. We present the pressure, frequency, and power scaling properties of these actuators and demonstrate that power density scales up as the inverse capillary diameter squared, leading to high-efficiency actuators with a strength density exceeding biological muscle. Two potential applications for microhydraulics are also demonstrated: soft-microrobotics and energy harvesting.
关键词： electrowetting,Microhydraulics,porous materials,energy conversion,electrocapillary,microsystems,soft robotics,energy harvesting,microrobotics,actuator,microfluidics,PDMS
更新于2025-09-19 17:13:59
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[IEEE 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC) - Chicago, IL, USA (2019.6.16-2019.6.21)] 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC) - Bulk Power System Dynamics with Varying Levels of Synchronous Generators and Grid-Forming Power Inverters
摘要： The conversion of electrical to mechanical power on a sub-centimeter scale is a key technology in many microsystems and energy harvesting devices. In this paper, we present a type of a capacitive energy conversion device that uses capillary pressure and electrowetting to reversibly convert electrical power to hydraulic power. These microhydraulic actuators use a high surface-to-volume ratio to deliver high power at a relatively low voltage with an energy conversion efficiency of over 65%. The capillary pressure generated grows linearly with shrinking capillary diameter, as does the frequency of actuation. We present the pressure, frequency, and power scaling properties of these actuators and demonstrate that power density scales up as the inverse capillary diameter squared, leading to high-efficiency actuators with a strength density exceeding biological muscle. Two potential applications for microhydraulics are also demonstrated: soft-microrobotics and energy harvesting.
关键词： microsystems,electrocapillary,soft robotics,PDMS,actuator,energy conversion,microfluidics,electrowetting,energy harvesting,porous materials,Microhydraulics,microrobotics
更新于2025-09-16 10:30:52
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Nano- and Microfabrication for Industrial and Biomedical Applications || Basic technologies for microsystems
摘要： This chapter introduces the reader the processes used to manufacture microelectronics. A silicon wafer is coated with a resist, most usually by wet deposition. Vapor deposition is also used, but high vacuum conditions are needed. The resist is a photosensitive polymer, which either cross-links or is destroyed under ultra violet (UV) light. Photolithography illuminates this resist through a pattern. The pattern is designed by computer-aided design (CAD), and copied onto a mask of borosilicate. Silicon is machined by wet chemical etching (which has precision limitations, but relatively low cost), or dry etching processes, in which its surface is bombarded with ions. Alternatively, the Bosch process uses gasses heated under low pressure to a plasma state to etch the surface. A great deal of research is under way to investigate other techniques and materials for use in microsystems. Examples include the use of powder blasting and laser ablation as etching techniques, and single-crystal (SC) quartz, amorphous glass, and thermoplastic polymers as alternatives to silicon. Thick resist lithography and locally controlled photopolymerization are techniques that could be used to create microscale features in these polymers. Since recent developments in industrial, biological, and biomedical applications particularly embrace replication technology as a means to pattern multiple parts from a master pattern or even use it for stamping biomolecular features onto a surface for the design and development of novel biological assays, it is time to introduce soft-lithography among the basic microsystems technologies together with a set of nanolithographies presented in Chapter 4.
关键词： soft-lithography,silicon micromachining,thin films,microsystems,nanolithography,photolithography
更新于2025-09-09 09:28:46