摘要： This chapter introduces the reader the processes used to manufacture microelectronics. A silicon wafer is coated with a resist, most usually by wet deposition. Vapor deposition is also used, but high vacuum conditions are needed. The resist is a photosensitive polymer, which either cross-links or is destroyed under ultra violet (UV) light. Photolithography illuminates this resist through a pattern. The pattern is designed by computer-aided design (CAD), and copied onto a mask of borosilicate. Silicon is machined by wet chemical etching (which has precision limitations, but relatively low cost), or dry etching processes, in which its surface is bombarded with ions. Alternatively, the Bosch process uses gasses heated under low pressure to a plasma state to etch the surface. A great deal of research is under way to investigate other techniques and materials for use in microsystems. Examples include the use of powder blasting and laser ablation as etching techniques, and single-crystal (SC) quartz, amorphous glass, and thermoplastic polymers as alternatives to silicon. Thick resist lithography and locally controlled photopolymerization are techniques that could be used to create microscale features in these polymers. Since recent developments in industrial, biological, and biomedical applications particularly embrace replication technology as a means to pattern multiple parts from a master pattern or even use it for stamping biomolecular features onto a surface for the design and development of novel biological assays, it is time to introduce soft-lithography among the basic microsystems technologies together with a set of nanolithographies presented in Chapter 4.