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Empirical design of slot-die having shallow reservoir for thin-film printed electronics
摘要： Slot-die coating plays an important role in printed electronics, which are fabricated by stacking thin films and patterns. As electronic devices are being required to have higher performance, the importance of coating uniformity cannot be overestimated in the slot-die coating. The coating uniformity consists of two directions: nozzle direction, which is affected by the interior design of the head, and machine direction, which is majorly related to exterior operating conditions. In this research, the empirical design procedure of a slot-die head is proposed. The internal resistance values of the slot-die were calculated using the experimental parameter obtained through a coating experiment, and the acquired resistances were reflected in the modeling of the interior design of the slot-die head. The hanger type reservoir was adapted to minimize the consumption of ink. After fabricating the slot-die head, coating experiments were carried out using PEDOT:PSS ink. The resulting deviation of the coating thickness was within ±1.7%, thus proving that the proposed design predicted the uniformity of the actual thickness of the coating correctly. The significance of the slot-die design method presented in this paper is that it is based on the experimental equation that can be readily applied to the printed electronics industry.
关键词： printed electronics,PEDOT:PSS ink,empirical design,coating uniformity,slot-die coating
更新于2025-09-11 14:15:04
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[IEEE 2018 76th Device Research Conference (DRC) - Santa Barbara, CA, USA (2018.6.24-2018.6.27)] 2018 76th Device Research Conference (DRC) - Exploring Silver Contact Morphologies in Printed Carbon Nanotube Thin-Film Transistors
摘要： Demand for ubiquitous and flexible electronics to facilitate the rapid growth of Internet-of-Things (IoT) technologies has driven the advancement of printed electronics for low-cost and high-throughput manufacturing. The carbon nanotube thin-film transistor (CNT-TFT) is one of the most promising options for printed electronics due to its mechanical flexibility, compatibility with low-temperature fabrication, and relatively high mobility [1]. Meanwhile, Ag nanoparticles remain the most widely used conductive material in printed inks due to their superb dispersion stability, high conductivity, and relatively low cost [2]. However, limited studies have explored the impact of different printed metallic contacts in CNT-TFTs [3], even though the contact interfaces are one of the leading factors limiting performance. In this work, the impact of Ag contact morphology is studied for the first time by fabricating hundreds of CNT-TFTs using an aerosol jet printer to systematically investigate three morphologies (nanoparticle (NP), nanoflake (NF), and nanowire (NW), as seen in Fig. 1) and their impact on device performance. Using what is learned from the contact morphology results, the first CNT-TFTs printed without removal of the substrate from the printer (full “print-in-place” additive devices) are also demonstrated.
关键词： printed electronics,aerosol jet printer,contact morphology,carbon nanotube thin-film transistor,Ag nanoparticles
更新于2025-09-10 09:29:36
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Dynamic Patterns of Technological Convergence in Printed Electronics Technologies: Patent Citation Network
摘要： The importance of the convergent approach to technology development has increased recently. Therefore, understanding the characteristics of technology convergence, which refers to the combination of two or more technological elements in order to create a new system with new functions, is an important issue not only for researchers in technology development, but also for company directors for their successful management of product competitiveness. Therefore, in order to investigate the patterns and the mechanism of technological convergence, we examine the printed electronics technology which has typical characteristics of technology convergence. Based on the printed electronics-related patents registered between 1976 and 2012, we perform network analysis of the technology components in order to identify key technologies which played a central role among the groups of convergence technologies and to examine their dynamic role corresponding to the development of technology convergence. The results show that control technologies which control the role of other technologies over the technology convergence process play significant role. The centrality value is highest in the case of control technology, and devices related technologies have the largest number of patents quantitatively, thereby confirming the results. In addition, the trajectory analysis of the centrality value reveals a co-evolution pattern in technology convergence.
关键词： Network analysis,Patent citation,Technological convergence,Printed electronics
更新于2025-09-10 09:29:36
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[IEEE 2018 13th International Congress Molded Interconnect Devices (MID) - Wu?rzburg (2018.9.25-2018.9.26)] 2018 13th International Congress Molded Interconnect Devices (MID) - Optimized Thermoforming Process for Conformable Electronics
摘要： 3D systems have attracted considerable attention lately. New technologies to realize such 3D electronics not only save weight and volume in known applications – e.g. car interior. They also allow completely new functionalities and systemic changes as the new smart structures and surfaces enable a novel interaction with the environment as well as with human beings through integrated sensors, actuators and electronics. The technology is and will be used in very different applications: Home appliances, Automotive, Robotics and Medical. Examples of first functionalities are operating elements such as switches or sliders in the form of capacitive sensors which can be integrated into three-dimensional surfaces. Conformable Electronics is largely based on established two-dimensional process technologies for the realization of the circuit carriers (printed circuit boards) as well as for the assembly of components as established in recent decades. Conformable electronics is manufactured in the same way as conventional electronic systems. It is endowed with the 3D shape, which goes beyond the typical properties of rigid and flexible printed circuit board in the last manufacturing step (thermoforming or injection molding). Flexible circuits cannot fully meet the requirements as they are only designed to bend and fold conductors around a single axis. A spherical surface, for example, cannot be covered without folds by a flat flex circuit. Therefore new materials and geometries for substrates and conductor lines have to be developed and investigated. To achieve the maximum freedom of design high levels of deformation are required. If realized with conventional thermoforming processes the deformation of base material and conductor tracks is very inhomogeneous which limits the geometries. In order to get predictable and homogeneous results which allow higher degrees of deformation a novel high resolution ceramic heater array for thermoforming has been developed. It allows controlled temperature distribution over the thermoformed area with lower temperatures where deformation has to be reduced. In combination with this heating technology a novel processing to produce conformable electronics is conceivable where first the circuit carriers will be applied and then the 3D geometry is formed.
关键词： conformable electronics,thermoforming,stretchable electronics,printed electronics
更新于2025-09-09 09:28:46
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All-2D Material Inkjet-Printed Capacitors: Towards Fully-Printed Integrated Circuits
摘要： A well-defined insulating layer is of primary importance in the fabrication of passive (e.g. capacitors) and active (e.g. transistors) components in integrated circuits. One of the most widely known 2-Dimensional (2D) dielectric materials is hexagonal boron nitride (hBN). Solution-based techniques are cost-effective and allow simple methods to be used for device fabrication. In particular, inkjet printing is a low-cost, non-contact approach, which also allows for device design flexibility, produces no material wastage and offers compatibility with almost any surface of interest, including flexible substrates. In this work we use water-based and biocompatible graphene and hBN inks to fabricate all-2D material and inkjet-printed capacitors. We demonstrate an areal capacitance of 2.0 ± 0.3 nF cm-2 for a dielectric thickness of ~3 μm and negligible leakage currents, averaged across more than 100 devices. This gives rise to a derived dielectric constant of 6.1 ± 1.7. The inkjet printed hBN dielectric has a breakdown field of 1.9 ± 0.3 MV cm-1. Fully printed capacitors with sub-μm hBN layer thicknesses have also been demonstrated. The capacitors are then exploited in two fully printed demonstrators: a resistor-capacitor (RC) low-pass filter and a graphene-based field effect transistor.
关键词： capacitors,2D-materials,integrated circuits,inkjet,printed electronics
更新于2025-09-09 09:28:46
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Direct Stereolithographic 3D Printing of Microfluidic Structures on Polymer Substrates for Printed Electronics
摘要： Both stereolithographic printing of microfluidics and inkjet printing of electronics are promising tools for the fabrication of lab-on-a-chip devices. However, the combination of these two technologies has been a challenge so far, as the 3D-printed components usually have to be bonded manually to the substrates functionalized with printed electronics. Here, a surface modification method is demonstrated for enabling the direct stereolithographic printing of microfluidic structures onto a variety of different substrates that are usually employed for printed electronics. The approach makes use of an acrylate-terminated silane that covalently binds substrate and polymer network of the 3D print. The bonding strength is quantified and the compatibility of the concept with printed electrodes in a microfluidic channel is evaluated.
关键词： additive manufacturing,3D printing,printed electronics,microfluidics
更新于2025-09-09 09:28:46
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Simultaneous reduction and surface functionalization of graphene oxide for highly conductive and water dispersible graphene derivatives
摘要： A simple and effective preparation method for the simultaneous reduction and functionalization of graphene oxide (rGO) by 2,4-diamino benzene sulfonic acid has been developed. The derivatives exhibit excellent conductivity and high dispersibility in various solvents. The successful preparation of rGO and the presence of the sulfonated aromatic diamine on rGO surface has been confirmed by infrared and X-ray photoelectron spectroscopy, while, the analysis by micro-Raman spectroscopy indicated that the reduction/functionalization alters the lattice structure of GO by the increment the defect density when the 2,4-diamino benzene sulfonic acid is used. Moreover, the study of the dried products by X-ray diffraction spectroscopy suggested the turbostratic restacking of the exfoliated rGO into graphite-like nanostructures. The obtained derivative of simultaneous reduction and functionalization of GO was used for the preparation of highly conductive water-based gravure ink, which in turn, was successfully applied in printing on various flexible substrates, demonstrating its great potentiality in graphene-based flexible and printed electronics applications.
关键词： Conductive inks,Printed electronics,Surface functionalization,Gravure,Reduced graphene oxide
更新于2025-09-09 09:28:46
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Accessing MHz Operation at 2 V with Field‐Effect Transistors Based on Printed Polymers on Plastic
摘要： Organic printed electronics are suitable for the development of wearable, lightweight, distributed applications in combination with cost-effective production processes. Nonetheless, some necessary features for several envisioned disruptive mass-produced products are still lacking: among these radio-frequency (RF) communication capability, which requires high operational speed combined with low supply voltage in electronic devices processed on cheap plastic foils. Here, it is demonstrated that high-frequency, low-voltage, polymer field-effect transistors can be fabricated on plastic with the sole use of a combination of scalable printing and digital laser-based techniques. These devices reach an operational frequency in excess of 1 MHz at the challengingly low bias voltage of 2 V, and exceed 14 MHz operation at 7 V. In addition, when integrated into a rectifying circuit, they can provide a DC voltage at an input frequency of 13.56 MHz, opening the way for the implementation of RF devices and tags with cost-effective production processes.
关键词： radio frequency,rectifiers,flexible organic transistors,laser sintering,printed electronics
更新于2025-09-04 15:30:14