研究目的

To demonstrate a surface modification method for enabling the direct stereolithographic printing of microfluidic structures onto a variety of different substrates that are usually employed for printed electronics, addressing the challenge of combining stereolithographic printing of microfluidics and inkjet printing of electronics.

研究成果

The proposed surface modification and direct 3D-printing approach offers a rapid prototyping option to easily integrate different types of substrates commonly used in printed electronics into microfluidic systems without any need for subsequent bonding after SL printing. This allows for the fabrication of a complete microfluidic sensing device without the use of cost-intensive cleanroom equipment.

研究不足

The method's effectiveness is dependent on the surface modification process, which may not be universally applicable to all types of substrates without optimization. The study also does not explore the long-term stability of the bonded structures under various environmental conditions.