- 标题
- 摘要
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A 38 dBi Gain, Low-Loss, Flat Array Antenna for 320 GHz to 400 GHz Enabled by Silicon-On-Insulator Micromachining
摘要： Two high-gain ?at array antenna designs operating in the 320 – 400 GHz frequency range are reported in this paper. The two antennas show measured gains of 32.8 dBi and 38 dBi and consist of a 16 × 16 (256) element array and a 32 × 32 (1024) element array, respectively, which are fed by a corporate H-tree beamforming network. The measured operation bandwidth for both antennas is 80 GHz (22 % fractional bandwidth), and the total measured ef?ciency is above ?2.5 dB and above ?3.5 dB for the two designs in the whole bandwidth. The low measured loss and large bandwidth are enabled by optimizing the designs to the process requirements of the SOI micromachining technology used in this work. The total height of the antennas is 1.1 mm (1.2 λ at the center frequency), with sizes of 15 mm × 18 mm and 27 mm × 30 mm for both arrays. The antennas are designed to be directly mounted onto a standard WM-570 waveguide ?ange. The design, fabrication, and measurements of eight prototypes are discussed in this paper and the performance of the antennas compared to the simulated data, as well as manufacturability and fabrication repeatability are reported in detail.
关键词： terahertz radiation,corporate beamforming network,array antennas,silicon micromachining,silicon on insulator,waveguide arrays,submillimeter-wave antennas
更新于2025-09-23 15:19:57
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Micromachined Waveguide Interposer for the Characterization of Multi-port Sub-THz Devices
摘要： This paper reports for the first time on a micromachined interposer platform for characterizing highly miniaturized multi-port sub-THz waveguide components. The reduced size of such devices does often not allow to connect them to conventional waveguide flanges. We demonstrate the micromachined interposer concept by characterizing a miniaturized, three-port, 220–330-GHz turnstile orthomode transducer. The interposer contains low-loss micromachined waveguides for routing the ports of the device under test to standard waveguide flanges and integrated micromachined matched loads for terminating the unused ports. In addition to the interposer, the measurement setup consists of a micromachined square-to-rectangular waveguide transition. These two devices enable the characterization of such a complex microwave component in four different configurations with a standard two-port measurement setup. In addition, the design of the interposer allows for independent characterization of its sub-components and, thus, for accurate de-embedding from the measured data, as demonstrated in this paper. The measurement setup can be custom-designed for each silicon micromachined device under test and co-fabricated in the same wafer due to the batch nature of this process. The solution presented here avoids the need of CNC-milled test-fixtures or waveguide pieces that deteriorate the performance of the device under test and reduce the measurement accuracy.
关键词： Test-fixture,Orthomode transducer,Terahertz,Multi-port,Measurement,Interposer,Silicon micromachining,Waveguide,DRIE
更新于2025-09-16 10:30:52
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A Low-Profile and High-Gain Frequency Beam Steering sub-THz Antenna Enabled by Silicon Micromachining
摘要： A very low-profile sub-THz high-gain frequency beam steering antenna, enabled by silicon micromachining, is reported for the first time in this paper. The operation bandwidth of the antenna spans from 220 GHz to 300 GHz providing a simulated field of view of 56?. The design is based on a dielectric filled parallel-plate waveguide (PPW) leaky-wave antenna fed by a pillbox. The pillbox, a two-level PPW structure, has an integrated parabolic reflector to generate a planar wave front. The device is enabled by two extreme aspect ratio, 16 mm x 16 mm large perforated membranes, which are only 30 μm thick, that provide the coupling between the two PPWs and form the LWA. The micromachined low-loss PPW structure results in a measured average radiation efficiency of ?1 dB and a maximum gain of 28.5 dBi with an input reflection coefficient below ?10 dB. The overall frequency beam steering frontend is extremely compact (24 mm x 24 mm x 0.9 mm) and can be directly mounted on a standard WM-864 waveguide flange. The design and fabrication challenges of such high performance antenna in the sub-THz frequency range are described and the measurement results of two fabricated prototypes are reported and discussed.
关键词： beam steering,leaky-wave antennas,silicon on insulator,terahertz radiation,silicon micromachining,quasi-optics,submillimeter-wave antennas
更新于2025-09-11 14:15:04
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Compact silicon-micromachined wideband 220-330 GHz turnstile orthomode transducer
摘要： This paper reports on a turnstile-junction orthomode transducer (OMT) implemented by silicon micromachining in the 220 – 330 GHz band. Turnstile OMTs are very wideband and allow for co-planar ports, but require accurate and complex geometries which makes their fabrication challenging at higher frequencies. The compact 10 x10 x0.9 mm3 OMT-chip presented in this paper is the first micromachined full-band OMT in any frequency range, and only the second turnstile OMT implemented above 110 GHz. The measured insertion loss (0.3 dB average, 0.6 dB worst-case) and the cross-polarization (60 dB average, 30 dB worst-case) over the whole waveguide band represent the best performance of any wideband OMT, regardless of design or fabrication technology, in the 220 – 330 GHz band. The return loss with 22 dB average (16 dB worst-case) is comparable or better than previous work. The paper discusses design considerations and compromises of this complex 9 layer silicon micromachined device, including the influence of sidewall slopes, underetching, and post-bonding misalignment between the chips. It is shown that for a device which is very sensitive to geometrical variations, such as a turnstile OMT, it is necessary to anticipate and compensate for any fabrication imperfections in the design to achieve high RF performance.
关键词： terahertz,mmW,DRIE,orthomode transducer,turnstile,silicon micromachining,THz,millimeter wave,MEMS,OMT
更新于2025-09-11 14:15:04
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Nano- and Microfabrication for Industrial and Biomedical Applications || Basic technologies for microsystems
摘要： This chapter introduces the reader the processes used to manufacture microelectronics. A silicon wafer is coated with a resist, most usually by wet deposition. Vapor deposition is also used, but high vacuum conditions are needed. The resist is a photosensitive polymer, which either cross-links or is destroyed under ultra violet (UV) light. Photolithography illuminates this resist through a pattern. The pattern is designed by computer-aided design (CAD), and copied onto a mask of borosilicate. Silicon is machined by wet chemical etching (which has precision limitations, but relatively low cost), or dry etching processes, in which its surface is bombarded with ions. Alternatively, the Bosch process uses gasses heated under low pressure to a plasma state to etch the surface. A great deal of research is under way to investigate other techniques and materials for use in microsystems. Examples include the use of powder blasting and laser ablation as etching techniques, and single-crystal (SC) quartz, amorphous glass, and thermoplastic polymers as alternatives to silicon. Thick resist lithography and locally controlled photopolymerization are techniques that could be used to create microscale features in these polymers. Since recent developments in industrial, biological, and biomedical applications particularly embrace replication technology as a means to pattern multiple parts from a master pattern or even use it for stamping biomolecular features onto a surface for the design and development of novel biological assays, it is time to introduce soft-lithography among the basic microsystems technologies together with a set of nanolithographies presented in Chapter 4.
关键词： soft-lithography,silicon micromachining,thin films,microsystems,nanolithography,photolithography
更新于2025-09-09 09:28:46
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[Institution of Engineering and Technology 12th European Conference on Antennas and Propagation (EuCAP 2018) - London, UK (9-13 April 2018)] 12th European Conference on Antennas and Propagation (EuCAP 2018) - Antennas for Space Instruments from GHz to THz
摘要： In this paper we present an overview of different antenna technologies for space-based instruments. We show that some of the designs that work well at gigahertz frequencies are difficult to implement at terahertz frequencies due to tight tolerance and rms surface finish requirements. We also show that antenna designs are dictated not only by the frequency of operations but also by the space platform of choice. In this paper, we also present ideas for low-profile terahertz antennas for implementation on SmallSat and CubeSat platforms.
关键词： silicon,micromachining,antenna,terahertz,low-profile,micro-lens
更新于2025-09-04 15:30:14