Temperature-dependent characterizations on parasitic capacitance of tapered through silicon via (T-TSV)

摘要： With increasing integration density of three-dimensional ICs, temperature is one of the major concern of circuit design, which influences the performance and reliability. In this paper, the parasitic capacitance of tapered TSV (T-TSV) with respect of thermal properties is studied. The concept of the Temperature Coefficient of Capacitance (TCC) is proposed to model the sensitive of TSV capacitance to temperature. It is found that TSV capacitance is sensitive to temperature under high frequency application, and the MOS capacitance variation is the main reason for the change of TSV capacitance and the TCC increases with elevated temperature. Furthermore, the affections of TSV dimensions on TCC are discussed. It is shown that the TCC increases gradually as the TSV radius increases, while the thickness of dielectric layer is the opposite. The cylinder TSV is less thermal sensitive than tapered TSV. This paper provides basis for TSV design considering the temperature effect.