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[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - A Simple Method of Adjusting Trigger Voltage of HBT Device for ESD Protection
摘要： The trigger voltage of the HBT device is important for ESD protection. A method of adjusting the trigger voltage of SiGe Heterojunction Bipolar Transistor (HBT) device is proposed in this paper. The simulation and experiment results show that the trigger voltage of HBT can be simply adjusted by varying the emitter junction area.
关键词： Trigger voltage,Electrostatic discharge (ESD),Heterojunction bipolar transistor (HBT)
更新于2025-09-19 17:15:36
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Cryogenic Characterization of RF Low-Noise Amplifiers Utilizing Inverse-Mode SiGe HBTs for Extreme Environment Applications
摘要： The cryogenic performance of radiation-hardened radio-frequency (RF) low-noise amplifiers (LNAs) is presented. The LNA, which was originally proposed for the mitigation of single-event transients (SETs) in a radiation environment, uses inverse-mode silicon-germanium (SiGe) heterojunction bipolar transistors (HBTs) in its core cascode stages. In this prototype, the upper common-base SiGe HBT is configured in inverse mode for balanced RF performance and reduced SET sensitivity. In order to better exploit the inverse-mode LNAs in a variety of extreme-environment applications, the RF performance of the LNA was characterized using liquid nitrogen to evaluate cryogenic operation down to 78 K. While the SiGe LNA exhibits acceptable RF performance for all temperature conditions, there is a noticeable gain drop observed at 78 K compared to the conventional forward-mode design. This is attributed to the limited high-frequency performance of an inverse-mode SiGe HBT. As a guideline, compensation techniques including layout modifications and profile optimization are discussed for the mitigation of the observed gain degradation.
关键词： low-noise amplifier (LNA),heterojunction bipolar transistor (HBT),cascode,inverse mode,extreme environment,cryogenic measurement,silicon-germanium (SiGe)
更新于2025-09-11 14:15:04
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A 128-Pixel System-on-a-Chip for Real-Time Super-Resolution Terahertz Near-Field Imaging
摘要： This paper presents a fully integrated system-on-a-chip for real-time terahertz super-resolution near-field imaging. The chip consists of 128 sensing pixels with individual cross-bridged double 3-D split-ring resonators arranged in a 3.2 mm long 2 × 64 1-D array. It is implemented in 0.13-μm SiGe bipolar complementary metal–oxide–semiconductor technology and operated at around 550 GHz. All the functions, including sensor illumination, near-field sensing, and detection, are co-integrated with a readout integrated circuit for real-time image acquisition. The pixels exhibit a permittivity-based imaging contrast with a worst case estimated relative permittivity uncertainty of 0.33 and 10–12-μm spatial resolution. The sensor illumination is provided with on-chip oscillators feeding four-way equal power divider networks to enable an effective pixel pitch of 25 μm and a dense fill factor of 48% for the 1-D sensing area. The oscillators are equipped with electronic chopping to avoid 1/f-noise-related desensitization for the SiGe-heterojunction bipolar transistor power detectors integrated at each pixel. The chip features both an analog readout mode and a lock-in-amplifier-based digital readout mode. In the analog readout mode, the measured dynamic range (DR) is 63.8 dB for a 1-ms integration time at an external lock-in amplifier. The digital readout mode achieves a DR of 38.5 dB at 28 f/s. The chip consumes 37–104 mW of power and is packaged into a compact imaging module. This paper further demonstrates real-time acquisition of 2-D terahertz super-resolution images of a nickel mesh with 50-μm feature size, as well as a biometric human fingerprint.
关键词： terahertz,system-on-a-chip (SoC),SiGe heterojunction bipolar transistor (HBT),split-ring resonator (SRR),near-field array,3-push Colpitts oscillator,super-resolution imaging,near-field scanning optical microscopy (NSOM),power detector
更新于2025-09-09 09:28:46
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Accurate and efficient analysis of the upward heat flow in InGaP/GaAs HBTs through an automated FEM-based tool and Design of Experiments
摘要： This paper presents an extensive analysis aimed at quantifying the impact of all the key technology parameters on the upward heat flow in state‐of‐the‐art InGaP/GaAs heterojunction bipolar transistors (HBTs) for various emitter areas and shapes. Extremely accurate thermal simulations are conducted in a relatively short time with a tool relying on a commercial 3‐D finite‐element method (FEM) solver and an in‐house routine for automated geometry construction, optimized mesh generation, sequential solution, and data storing/processing. Design of Experiments is used to define a thermal resistance model as a function of the aforementioned parameters on the basis of a few FEM data.
关键词： finite‐element method (FEM),gallium arsenide (GaAs),Design of Experiments (DOE),thermal simulation,thermal resistance,heterojunction bipolar transistor (HBT)
更新于2025-09-04 15:30:14
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[IEEE 2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) - San Diego, CA, USA (2018.10.15-2018.10.17)] 2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) - 450 GHz <tex>$f_{\text{T}}$</tex> SiGe:C HBT Featuring an Implanted Collector in a 55-nm CMOS Node
摘要： This paper deals with the optimization of a Si/SiGe HBT featuring an implanted collector and a DPSA-SEG emitter-base architecture. Arsenic and phosphorous doping species are studied. On the one hand, both silicon defects and dopants profiles control are evaluated and on the other hand, hf performances are presented. Carbon-phosphorous co-implantation is also investigated and a state-of-the-art 450 GHz fT HBT compatible with 55-nm MOSFETs is demonstrated through a device layout study.
关键词： MOSFET,Implanted Collector,Heterojunction Bipolar Transistor (HBT),Silicon-Defects
更新于2025-09-04 15:30:14