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[IEEE 2019 IEEE 16th International Conference on Group IV Photonics (GFP) - Singapore, Singapore (2019.8.28-2019.8.30)] 2019 IEEE 16th International Conference on Group IV Photonics (GFP) - Reliability of CMOS-Compatible Ti / n-InP and Ti / p-InGaAs Ohmic Contacts for Hybrid III-V / Si Lasers
摘要： Electrical properties of CMOS-compatible titanium contacts on n-InP and p-In0.53Ga0.47As using 300 mm tools, in the scope of integrating them on III-V / Si hybrid lasers, are presented. Electrical behaviors after i) processing, ii) integration and back-end sequences, and iii) several simulated laser uses were investigated.
关键词： III-V / Si hybrid lasers,n-InP,reliability,CMOS-compatible,titanium contacts,p-InGaAs
更新于2025-09-16 10:30:52
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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Additive Laser Metal Deposition Onto Silicon for Enhanced Microelectronics Cooling
摘要： We previously demonstrated how the Sn3Ag4Ti alloy can robustly bond onto silicon via selective laser melting (SLM). By employing this technology, thermal management devices (e.g., micro-channels, vapor chamber evaporators, heat pipes) can be directly printed onto the electronic package (silicon die) without using thermal interface materials. Under immersion two-phase cooling (pool boiling), we compare the performance of three chip cooling methods (conventional heat sink, bare silicon die and additively manufactured metal micro-fins) under high heat flux conditions (100 W/cm2). Heat transfer simulations show a significant reduction in the chip temperature for the silicon micro-fins. Reduction of the chip operating temperature or increase in clock speed are some of the advantages of this technology, which results from the elimination of thermal interface materials in the electronic package. Performance and reliability aspects of this technology are discussed through experiments and computational models.
关键词： Performance and Reliability,Thermal Management,Laser Metal Deposition,Additive Manufacturing,Electronic Cooling
更新于2025-09-16 10:30:52
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[IEEE 2019 21st International Conference on Transparent Optical Networks (ICTON) - Angers, France (2019.7.9-2019.7.13)] 2019 21st International Conference on Transparent Optical Networks (ICTON) - Machine Learning Based Laser Failure Mode Detection
摘要： Laser degradation analysis is a crucial process for the enhancement of laser reliability. Here, we propose a data-driven fault detection approach based on Long Short-Term Memory (LSTM) recurrent neural networks to detect the different laser degradation modes based on synthetic historical failure data. In comparison to typical threshold-based systems, attaining 24.41% classification accuracy, the LSTM-based model achieves 95.52% accuracy, and also outperforms classical machine learning (ML) models namely Random Forest (RF), K-Nearest Neighbours (KNN) and Logistic Regression (LR).
关键词： degradation,laser,reliability,fault detection,machine learning,recurrent neural networks
更新于2025-09-16 10:30:52
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Reliability implications of partial shading on CIGS photovoltaic devices: A literature review
摘要： Partial shading of Cu(In,Ga)(Se,S)2 (CIGS) photovoltaic (PV) modules is getting more attention, as is witnessed by the increase in publications on this topic in recent years. This review will give an overview of shading tests executed on CIGS modules and focuses on the more fundamental aspects that are often studied on cells. Generally, CIGS modules display very attractive performance under predictable row-to-row shading. However, potential damage could occur under nonoptimal shading orientations: module output after shading tests could reduce due to the formation of local shunts, often called wormlike defects. The influence of many factors on the formation of these defects, including the internal currents and voltages and the shape and intensity of the shade, will be discussed. This review allows an increased insight in the degradation mechanisms caused by partial shading, which would ultimately lead to the introduction of more shade-tolerant CIGS PV products in the future.
关键词： photovoltaic modules,partial shading,CIGS,wormlike defects,reliability
更新于2025-09-16 10:30:52
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Random Voids Generation and Effect of Thermal Shock Load on Mechanical Reliability of Light-Emitting Diode Flip Chip Solder Joints
摘要： To make the light-emitting diode (LED) more compact and effective, the flip chip solder joint is recommended in LED chip-scale packaging (CSP) with critical functions in mechanical support, heat dissipation, and electrical conductivity. However, the generation of voids always challenges the mechanical strength, thermal stability, and reliability of solder joints. This paper models the 3D random voids generation in the LED flip chip Sn96.5–Ag3.0–Cu0.5 (SAC305) solder joint, and investigates the effect of thermal shock load on its mechanical reliability with both simulations and experiments referring to the JEDEC thermal shock test standard (JESD22-A106B). The results reveal the following: (1) the void rate of the solder joint increases after thermal shock ageing, and its shear strength exponentially degrades; (2) the first principal stress of the solder joint is not obviously increased, however, if the through-hole voids emerged in the corner of solder joints, it will dramatically increase; (3) modelling of the fatigue failure of solder joint with randomly distributed voids utilizes the approximate model to estimate the lifetime, and the experimental results confirm that the absolute prediction error can be controlled around 2.84%.
关键词： randomly distributed voids,solder joint,flip chip,light-emitting diode,reliability
更新于2025-09-16 10:30:52
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Damp Heat Induced Degradation of Silicon Heterojunction Solar Cells With Cu-Plated Contacts
摘要： Damp heat exposure is one of the most stringent environments for testing the durability of solar cells in packaged modules. Damp heat stresses and induces a variety of degradation modes in solar cells and modules: for example, moisture-induced corrosion of electrodes and interconnections, deterioration of polymeric materials, and/or thermally activated diffusion processes. To screen for these and other potential degradation modes, we subject one-cell modules containing silicon heterojunction (SHJ) solar cells with Cu-plated contacts to extended damp heat tests at 85 °C/85% relative humidity. SHJ cells were laminated with two common encapsulants: ethylene vinyl acetate (EVA) and polyole?n elastomer (POE), and two constructions: glass–backsheet and glass–glass. We observe degradation in all components of solar cell maximum power (PMP): current, voltage, and ?ll factor, and ?nd evidence of increased carrier recombination and nonideal diode behavior with increasing stress. For glass–backsheet constructions, EVA samples generally degrade more than POE by a factor of approximately 1.5x PMP, and the different encapsulants produce different degradation patterns. Similar trends are observed in glass–glass modules, but to a lesser degree. In a different experiment, we observe a decrease in effective minority carrier lifetime of nonmetallized SHJ precursors measured after damp heat. This implies that some degradation unrelated to the contacts is to be expected and con?rms the observation of increasing recombination.
关键词： Copper (Cu) plated contacts,reliability,silicon heterojunction (SHJ),?ll factor (FF),encapsulant,damp heat (DH)
更新于2025-09-16 10:30:52
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Performance assessment of domestic photovoltaic power plant with a storage system
摘要： Grid-connected low voltage photovoltaic power plants cover the majority of the power capacity installed in Italy. They offer an important contribution to the power demand of the utilities connected but, due to the nature of the solar resource, the night time consumption can be satisfied only withdrawing the energy by the national grid, at the price of the energy distributor. Thanks to the improvement of storage technologies and the decreasing of costs, the installation of a system of battery looks a promising solution. In this paper, a model-based approach to analyze and discuss the performance of a domestic photovoltaic power plant with a storage system is presented.
关键词： Service Availability,Dynamic Reliability,Retrofit Photovoltaic Power Plant,Monte Carlo Simulation
更新于2025-09-16 10:30:52
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[IEEE 2019 International Conference on Power, Energy and Innovations (ICPEI) - Pattaya, Chonburi, Thailand (2019.10.16-2019.10.18)] 2019 International Conference on Power, Energy and Innovations (ICPEI) - Modelling of photovoltaic power plants and loads for dynamic simulations in power system
摘要： This paper presents an effect to power system when high penetration of photovoltaic (PV) power plants are in a conventional power system. Firstly, the increased behaviors of the PV array model are studied before PV power plants are connected to the conventional system represented by the IEEE 39 Bus system. A control system consisting of maximum power point tracking (MPPT) controller, voltage source controller (VSC), DC-DC boost converter and AC-DC inverter is modeled to operate along with other equipment in the system. The simulations are subsequently carried out to observe the effect of different disturbance conditions, i.e. three phase fault as well as tripping of load and generator in the system. The results of PV integration to the system coordinated with different disturbance conditions expose that a greater number of PV in the power system leads to higher power system instability and unreliability.
关键词： photovoltaic,stability,dynamic simulation,disturbance,reliability
更新于2025-09-16 10:30:52
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Temperature Accelerated Life Test and Failure Analysis on Upright Metamorphic Ga <sub/>0.37</sub> In <sub/>0.63</sub> P/Ga <sub/>0.83</sub> In <sub/>0.17</sub> As/Ge Triple Junction Solar Cells
摘要： A temperature accelerated life test on Upright Metamorphic Ga0.37In0.63P/Ga0.83In0.17As/Ge triple‐junction solar cells has been carried out. The acceleration has been accomplished by subjecting the solar cells to temperatures (125, 145 and 165°C) significantly higher than the nominal working temperature inside a concentrator (90°C), while the nominal photo‐current (500×) has been emulated by injecting current in darkness. The failure distributions have been fitted to an Arrhenius–Weibull model resulting in an activation energy of 1.39 eV. Accordingly, a 72 years warranty time for those solar cells for a place like Tucson (AZ, USA), was determined. After the ALT, an intense characterization campaign has been carried out in order to determine the failure origin. We have detected that temperature soak alone is enough to degrade the cell performance by increasing the leakage currents, the series resistance, and the recombination currents. When solar cells were also forward biased an increase of series resistance together with a reduction of short circuit current is detected. The failure analysis shows that: a) several metallization sub‐products concentrate in several regions of front metal grid where they poison the silver, resulting in a two times reduction of the metal sheet resistance; b) the metal/cap layer interface is greatly degraded and there is also a deterioration of the cap layer crystalline quality producing a huge increase of the specific front contact resistance, c) the decrease of short circuit current is mainly due to the GaInP top subcell degradation.
关键词： CPV,upright metamorphic solar cells,triple‐junction solar cells,solar cell reliability,failure analysis
更新于2025-09-16 10:30:52
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Risk priority number for understanding the severity of photovoltaic failure modes and their impacts on performance degradation
摘要： The alleged reliability has led the longest warranty period for Photovoltaic (PV) modules up to 20-25 years; it becomes possible after understanding the failure mode and degradation analysis of PV module. Failure mode decreases the performance of the PV module throughout the long-term outdoor exposure. The main objective of the present study is to identify the failure mechanism and failure mode of solar PV modules and their impact on degradation in operating conditions. Assessment of previous studies on rate indicates the highest performance losses at initial stage of outdoor exposure and a degradation drop-off of 0.014% per year. In this context, risk priority number (RPN) analysis is carried out to identify the severity of the failure mode, which affect the system performance for c-Si technologies. However, hot spot and de-lamination are degradation modes related to safety issue with lower value of RPN <50.
关键词： Degradation,Crystalline silicon,PV module defects,Reliability,Risk priority number,PV failure mode
更新于2025-09-16 10:30:52