- 标题
- 摘要
- 关键词
- 实验方案
- 产品
-
[ASME ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - San Francisco, California, USA (Monday 27 August 2018)] ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling
摘要： Fatigue failure of solder joints is one of the most common methods by which electronic packages fail. Electronic assemblies usually must cope with a temperature varying environment. Due to the mismatches in coefficients of thermal expansion (CTEs) of the various assembly materials, the solder joints are subjected to cyclic thermal-mechanical loading during temperature cycling. The main focus of this work is to investigate the changes in microstructure that occur in SAC305 and SAC+Bi lead free solders subjected to mechanical cycling. In this paper, we report on results for the SAC+Bi solder commonly known as SAC_Q or CYCLOMAX. Uniaxial solder specimens were prepared in glass tubes, and the outside surfaces were polished. A nanoindenter was then used to mark fixed regions on the samples for subsequent microscopy evaluation. The samples were subjected to mechanical cycling, and the microstructures of the selected fixed regions were recorded after various durations of cycling using Scanning Electron Microscopy (SEM). Using the recorded images, it was observed that the cycling induced damage consisted primarily of small intergranular cracks forming along the subgrain boundaries within dendrites. These cracks continued to grow as the cycling continued, resulting in a weakening of the dendrite structure, and eventually to the formation of large transgranular cracks. The distribution and size of the intermetallic particles in the inter-dendritic regions were observed to remain essentially unchanged.
关键词： Bismuth,Microstructure,SAC Alloy,Hysteresis,Evolution,Lead Free Solder,Cyclic Stress-Strain Curve
更新于2025-09-23 15:22:29
-
[ASME ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - San Francisco, California, USA (Monday 27 August 2018)] ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Investigation of the Effects of High Temperature Aging on the Mechanical Behavior of Lead Free Solders
摘要： Lead free solders are renowned as interconnects in electronic packaging due to their relatively high melting point, attractive mechanical properties, thermal cycling reliability, and environment friendly chemical properties. The mechanical behavior of lead free solders is highly dependent on the operating temperature. Previous investigations on mechanical characterization of lead free solders have mainly emphasized stress-strain and creep testing at temperatures up to 125 °C. However, electronic devices, sometimes, experience harsh environment applications including well drilling, geothermal energy, automotive power electronics, and aerospace engines where solders are exposed to very high temperatures from 125-200 °C. Mechanical properties of lead free solders at elevated temperatures are limited. In this work, we have investigated the mechanical behavior SAC305 (96.5Sn-3.0Ag-0.5Cu) and SAC_Q (SAC+Bi) lead free solders at extreme high temperatures up to 200 °C. Stress-strain tests were performed on reflowed uniaxial specimens at four elevated temperatures (T = 125, 150, 175, and 200 °C). In addition, changes of the mechanical behavior of these alloys due to isothermal aging at T = 125 oC have been studied. Extreme care has been taken during specimen preparation so that the fabricated solder uniaxial test specimens accurately reflect the solder material microstructures present in actual lead free solder joints. High temperature tensile properties of the solders including initial modulus, yield stress, and ultimate tensile strength have been compared. As expected, our results show substantial degradations of the mechanical properties of lead-free solders at higher temperatures. With prior aging, these degradations become even more significant. Comparison of the results has shown that the addition of Bi to traditional SAC alloys improves their high temperature properties and significantly reduces their aging induced degradations.
关键词： Yield Stress,Ultimate Tensile Strength,Stress-Strain Curve,SAC alloy,Modulus,Lead-Free Solder,Aging
更新于2025-09-09 09:28:46