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[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden, Germany (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - Integration with Light
摘要： This paper reports the use of Laser-induced Forward Transfer (LIFT) technology for printing of multilayer flexible circuitries and the fabrication of micro-bumps for flip-chip bonding of packaged LEDs and bare die microcomponents. Bonding of passive and functional surface mount devices (SMD) on low-temperature polyethylene terephthalate (PET) foils have been demonstrated using two selective bonding techniques. Firstly, using a high intensity near-infrared (NIR) lamp, a bare die NFC chip was bonded on micro-bumps formed with LIFT printed isotropic conductive adhesive (ICA) within less than a minute. Secondly, using a high intensity Xenon lamp, passive components and packaged LEDs were bonded within 5 seconds on micro-bumps formed with conventional Sn–Ag–Cu (SAC) lead-free alloys. In the both cases, due to selective light absorption, a limited temperature increase was observed in the PET substrates allowing successful bonding of components onto the delicate polyethylene foil substrates using conventional interconnect materials.
关键词： LIFT,low temperature bonding,NIR curing,conductive adhesive,lead-free SAC solder,photonic soldering,flip-chip bonding,laser printing
更新于2025-09-23 15:23:52
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AIP Conference Proceedings [AIP Publishing 15th International Conference on Concentrator Photovoltaic Systems (CPV-15) - Fes, Morocco (25–27 March 2019)] 15th International Conference on Concentrator Photovoltaic Systems (CPV-15) - Electrical and optical analysis of a spray coated transparent conductive adhesive for two-terminal silicon based tandem solar cells
摘要： This work presents the results of the electrical and optical characterization of a new transparent conductive adhesive (TCA) that combines the techniques of spray pyrolysis and a sol-gel like process. This approach is of particular interest since the adhesive itself forms both the electrical and the mechanical interconnection of the bonded sub-cells. The electrical and optical characterization of the developed TCA shows a minimum connecting resistivity of 17 ?cm2 and a simulated reflection at the Si-TCA interface of ≈ 20%. By coating both substrate surfaces with a TiO2 anti reflection coating (ARC), the reflectance at the Si-TCA interface was successfully reduced down to <5%. The efficiency potential of a glued dual junction device was simulated in dependence of the electrical and optical properties of the TCA. The reported values of 17 ?cm2 connecting resistivity and 20% reflection limit the device efficiency to 22.3% (71% of the maximum achievable efficiency). Reducing the reflection to below 5%, as practically demonstrated in this paper, allows to increase this value to 25.3% (>80% of maximum), while additionally reducing the connecting resistivity to 10 ?cm2 or 1 ?cm2 allows for a further increase to 27.3% and 30.0%, respectively.
关键词： reflection losses,sol-gel process,tandem solar cells,connecting resistivity,TiO2 anti reflection coating,electrical characterization,transparent conductive adhesive,optical characterization,spray pyrolysis
更新于2025-09-11 14:15:04
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Self-Assembly Synthesis of Silver Nanowires/Graphene Nanocomposite and Its Effects on the Performance of Electrically Conductive Adhesive
摘要： Among recent advances in electronic packaging technologies, electrically conductive adhesives (ECAs) attract most researchers’ attention, as they are environment-friendly and simple to apply. ECAs also have a lower operating temperature and volume resistivity compared with conventional electronic conductive adhesives. In ECAs, the conducting ?llers play a signi?cant role in improving conductivity and strength. In this work, as ?ller additives, the silver nanowires/ graphene nanocomposites (AgNWs-GNs) were successfully fabricated via a facile self-assembly method. The characteristics of the as-prepared nanocomposites were evaluated by FTIR (Fourier Transform infrared spectroscopy), XRD (X-ray Diffraction), XPS (X-ray photoelectron spectroscopy), TEM (Transmission electron microscope) and Raman tests, demonstrating a successful synthesis process. Different amounts of AgNWs-GNs were used as additives in micron ?ake silver ?ller, and the effects of AgNWs-GNs on the properties of ECAs were studied. The results suggested that the as-synthesized composites can signi?cantly improve the electrical conductivity and shear strength of ECAs. With 0.8% AgNWs/GNs (AgNWs to GO (Graphite oxide) mass ratio is 4:1), the ECAs have the lowest volume resistivity of 9.31 × 10?5 ?·cm (95.4% lower than the blank sample without ?llers), while with 0.6% AgNWs/GNs (AgNWs to GO mass ratio is 6:1), the ECAs reach the highest shear strength of 14.3 MPa (68.2% higher than the blank sample).
关键词： electrically conductive adhesive,volume resistivity,graphene,silver nanowires
更新于2025-09-09 09:28:46