研究目的
To demonstrate the use of Laser-induced Forward Transfer (LIFT) for printing multilayer flexible circuitries and micro-bumps, and to bond components on low-temperature PET foils using selective bonding techniques with NIR and Xenon lamps.
研究成果
LIFT technology is effective for printing multilayer flexible circuitries and micro-bumps, enabling bonding of components on low-temperature PET foils using selective NIR curing and photonic soldering. The methods allow rapid processing (e.g., within 5 seconds for soldering) with minimal substrate heating, demonstrating feasibility for flexible electronics applications. Future work could focus on improving resolution and scalability for industrial roll-to-roll processes.
研究不足
The resolution of LIFT printing with microparticle pastes is limited (e.g., 300 μm line width), and precise alignment is required for laser bonding in roll-to-roll settings. Component size and material properties affect the energy requirements for photonic soldering, necessitating customized illumination strategies.
1：Experimental Design and Method Selection:
The study employs LIFT printing for material deposition and two selective bonding methods (NIR curing and photonic soldering) to integrate components on flexible PET substrates, leveraging selective light absorption for low-temperature processing.
2：Sample Selection and Data Sources:
Samples include PET foils (e.g., V109 from AGFA), conductive pastes (e.g., Dupont 5025), dielectric materials (e.g., LuxPrint 8153), ICA from Henkel, solder paste (NC-560-LF from Amtech), and various SMD components (e.g., resistors from Panasonic, LEDs from ROHM, NFC chips from NXP).
3：List of Experimental Equipment and Materials:
Equipment includes a nanosecond Nd:YAG UV laser (AVIA-355-4500 from Coherent), galvanometer scanner (Hurryscan from Scanlab), f-theta lens (from Sill), NIR lamp system (M3, adphosNIR?), xenon lamp system (PulseForge 1300 from Novacentrix), pick and place machine (T3200 from Dr. Tresky), and materials such as PET foils, pastes, adhesives, and components.
4：Experimental Procedures and Operational Workflow:
For LIFT printing, laser parameters are optimized for depositing materials; for bonding, components are placed and cured/soldered using NIR or flash lamp illumination with specific energy dosages and pulse parameters.
5：Data Analysis Methods:
Analysis involves optical imaging to assess print quality and bonding success, with energy measurements using integrated bolometers for flash lamp parameters.
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Nd:YAG UV laser
AVIA-355-4500
Coherent
Used for LIFT printing experiments to deposit materials from a donor to a receiver substrate.
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Packaged LED
SML-P12MT
ROHM
PICOLED? used in bonding demonstrations for flexible lighting applications.
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Bare die NFC chip
NTag NT2L1011G0DUD
NXP Semiconductors
Thinned down and bonded onto printed NFC antennas for functionality testing.
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Thick film chip resistor
0402, 0603, 1206
Panasonic
Passive components used in photonic soldering experiments to test bonding on flex substrates.
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Packaged LED
SML-P12YT
ROHM
PICOLED? used in photonic soldering experiments for flexible electronics.
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Galvanometer scanner
Hurryscan
Scanlab
Guides the laser focal spot in the x-y plane for precise material deposition during LIFT printing.
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f-theta lens
Sill
Focuses the laser beam through the carrier onto the donor surface in the LIFT setup.
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NIR lamp
M3
adphosNIR
Provides high-intensity near-infrared illumination for curing conductive patterns and bonding components selectively.
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Xenon lamp system
PulseForge 1300
Novacentrix
Used for photonic soldering with flash illumination to solder components on flex substrates rapidly.
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Pick and place machine
T3200
Dr. Tresky
Semiautomatically places SMD components onto the flex substrates for bonding experiments.
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PET foil
V109
AGFA
Serves as the flexible substrate for printing circuitries and bonding components, with acrylic coating.
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Ag-filled screen printing paste
5025
Dupont
Used for LIFT printing of conductive tracks on PET foils.
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Dielectric paste
LuxPrint 8153
DuPont
Acts as an insulating layer in multilayer circuitries printed via LIFT.
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Isotropic conductive adhesive
Henkel
Development epoxy-based Ag-filled ICA used for bonding components via NIR curing.
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Solder paste
NC-560-LF
Amtech
Lead-free Sn96.5Ag3.8Cu0.5 alloy used for photonic soldering of components on flex circuits.
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PET-Cu-Sn foil
Double-sided PET foil with embedded electroplated copper tracks and tin finish, used as receiving substrate for soldering.
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