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- 摘要
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- 实验方案
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Manufacturing of All Inkjet-Printed Organic Photovoltaic Cell Arrays and Evaluating their Suitability for Flexible Electronics
摘要： The generation of electrical energy depending on renewable sources is rapidly growing and gaining serious attention due to its green sustainability. With fewer adverse impacts on the environment, the sun is considered as a nearly infinite source of renewable energy in the production of electrical energy using photovoltaic devices. On the other end, organic photovoltaic (OPV) is the class of solar cells that offers several advantages such as mechanical flexibility, solution processability, environmental friendliness, and being lightweight. In this research, we demonstrate the manufacturing route for printed OPV device arrays based on conventional architecture and using inkjet printing technology over an industrial platform. Inkjet technology is presently considered to be one of the most matured digital manufacturing technologies because it offers inherent additive nature and last stage customization flexibility (if the main goal is to obtain custom design devices). In this research paper, commercially available electronically functional inks were carefully selected and then implemented to show the importance of compatibility between OPV material stacks and the device architecture. One of the main outcomes of this work is that the manufacturing of the OPV devices was accomplished using inkjet technology in massive numbers ranging up to 1500 containing different device sizes, all of which were deposited on a flexible polymeric film and under normal atmospheric conditions. In this investigation, it was found that with a set of correct functional materials and architecture, a manufacturing yield of more than 85% could be accomplished, which would reflect high manufacturing repeatability, deposition accuracy, and processability of the inkjet technology.
关键词： inkjet technology,flexible electronics,organic photovoltaics,Indium Tin Oxide (ITO) free solar cells
更新于2025-11-14 17:28:48
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Epitaxial Liftoff of Wafer‐Scale VO <sub/>2</sub> Nanomembranes for Flexible, Ultrasensitive Tactile Sensors
摘要： Highly sensitive tactile sensors with long-term stability and low power consumption are one of the key components for flexible electronics. Here, for the first time, the fabrication of VO2 nanomembrane tactile sensors by epitaxial liftoff from ZnO sacrificial layer is reported. The wafer-scale nanomembranes inherit the structural and electrical properties of the as-grown films, and the wet transfer generates negligible influence on the quality of VO2. Most importantly, giant electrical responses to external strains are found due to the release of substrate clamping, and a high gauge factor up to ≈1100 is derived. Furthermore, the electrical properties show no deterioration after repeatedly bending the nanomembranes for 10 000 times at a radius of 1 cm. The VO2 nanomembrane sensors are utilized to monitor the radial artery pulse, and totally reproducible waveforms with ultrahigh sensitivity to the tactile stimuli are observed. Moreover, the power dissipation of the VO2 tactile sensors can be lowered down to the picowatt level, allowing for the future construction of self-powered sensing systems together with nanogenerators. This study provides a substantial step toward large-scale preparation of oxide nanomembranes and therefore paves a promising way for flexible oxide electronics.
关键词： flexible electronics,piezoresistivity,vanadium dioxide,tactile sensors,epitaxial liftoff
更新于2025-11-14 17:03:37
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[IEEE 2018 18th International Symposium on Antenna Technology and Applied Electromagnetics (ANTEM) - Waterloo, ON (2018.8.19-2018.8.22)] 2018 18th International Symposium on Antenna Technology and Applied Electromagnetics (ANTEM) - 3-D Printed Flexible Heterogeneous Substrates with Customizable Gain and Bandwidth
摘要： This paper presents a 3-D printed flexible heterogeneous substrate for wearable antennas with customizable bandwidth and gain. These performance parameters are modified by varying the ratio of percentage area of Acrylonitrile Butadiene Styrene (ABS) to NinjaFlex. Five flexible 3-D printed microstrip patch antenna (MPA) prototypes are designed, realized and measured each with different percentage area ratios, where the MPA’s RF performance is characterized with curvature. The five substrate designs are based on a combination of rigid ABS tiles of triangular shape surrounded with flexible NinjaFlex. All five designs show minimal antenna sensitivity to curvature, with a minimum resonant frequency shift of less than 1.2%. Results closely agree with simulations. Increasing the ABS area increases the MPA’s gain, but reduces the bandwidth and increases substrate rigidity. This results in a highly customizable and cost-effective substrate that allows the antenna designer flexibility in the choice of design parameters.
关键词： conformal antenna,3-D printing,wearable antenna,flexible,patch antenna,ABS,flexible electronics,NinjaFlex
更新于2025-09-23 15:23:52
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RF Characterization of NiO and TiO <sub/>2</sub> Based Metal-Insulator-Metal (MIM) Diodes on Flexible Substrates
摘要： This paper presents the fabrication and characterization of metal-insulator-metal (MIM) diodes on flexible substrates for RF and microwave circuit applications. Diodes using two types of insulators, titanium dioxide (TiO2) and nickel oxide (NiO), are investigated. These insulators are obtained using different oxidation techniques, i.e., in-situ oxidation for TiO2 and plasma oxidation for NiO. Asymmetric metal contacts (Ti-TiO2-Pd and Ni-NiO-Mo) are utilized to achieve nonlinear I–V characteristics. The fabricated diodes show strong non-linearity, high current densities, and low turn-ON voltage. The diodes show RF to dc rectification with near-ideal behavior and rectification sensitivity of 22 V/W (18 GHz) and 46 V/W (18 GHz) for TiO2 and NiO, respectively. NiO-based diodes barrier shows higher current density and higher cutoff frequency in comparison with TiO2 as expected diodes due to thinner oxide and lower dielectric constant. The diodes also work well as frequency doublers over a wide frequency range of 1–4 GHz for TiO2 and 2–10 GHz for NiO-based diodes. Good dc and RF performance of diodes indicate that good quality oxide can be achieved on plastic substrates and MIM devices can provide a perfect solution for RF and microwave circuits on a flexible substrate.
关键词： MIM diodes,rectification,Flexible electronics,harmonic generation,thin film devices,microwave circuits
更新于2025-09-23 15:23:52
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Carbon Nanotube Thin Films for High-Performance Flexible Electronics Applications
摘要： Carbon nanotube thin films have attracted considerable attention because of their potential use in flexible/stretchable electronics applications, such as flexible displays and wearable health monitoring devices. Due to recent progress in the post-purification processes of carbon nanotubes, high-purity semiconducting carbon nanotubes can be obtained for thin-film transistor applications. One of the key challenges for the practical use of carbon nanotube thin-film transistors is the thin-film formation technology, which is required for achieving not only high performance but also uniform device characteristics. In this paper, after describing the fundamental thin-film formation techniques, we review the recent progress of thin-film formation technologies for carbon nanotube-based flexible electronics.
关键词： Flexible electronics,Carbon nanotube,Thin film
更新于2025-09-23 15:23:52
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[IEEE 2018 International Flexible Electronics Technology Conference (IFETC) - Ottawa, ON, Canada (2018.8.7-2018.8.9)] 2018 International Flexible Electronics Technology Conference (IFETC) - Flexible Printed Organic Thin-Film Transistor Devices and Integrated Circuit Applications
摘要： The latest developments in flexible and printed electronics technology based on organic thin-film transistor (OTFT) devices as well as printable electronic materials are briefly reported on in this paper. The successful fabrication and operation of printed OTFT devices and a variety of integrated circuit applications such as flip-flop logic gates and operational amplifiers will be demonstrated.
关键词： Organic electronics,Flexible electronics,Organic thin-film transistor,Printed electronics
更新于2025-09-23 15:22:29
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Universal Testing Apparatus Implementing Various Repetitive Mechanical Deformations to Evaluate the Reliability of Flexible Electronic Devices
摘要： A requirement of flexible electronic devices is that they maintain their electrical performance during and after repetitive mechanical deformation. Accordingly, in this study, a universal test apparatus is developed for in-situ electrical conductivity measurements for flexible electrodes that are capable of applying various mechanical deformations such as bending, twisting, shearing, sliding, stretching, and complex modes consisting of two simultaneous deformations. A novel method of deforming the specimen in an arc to induce uniform bending stress in single and alternating directions is also proposed with a mathematically derived control method. As an example of the arc bending method, the changes in the resistance of the printed radio frequency identification (RFID) tag antennas were measured by applying repetitive inner bending, outer bending, and alternating inner-outer bending. After 5000 cycles, the increases in resistance of the specimens that were subjected to inner or outer bending only were under 30%; however, specimens that were subjected to alternating inner-outer bending showed an increase of 135% in resistance. It is critical that the reliability of flexible electronic devices under various mechanical deformations be determined before they can be commercialized. The proposed testing apparatus can readily provide various deformations that will be useful to inform the design of device shapes and structures to accommodate deformations during use.
关键词： mechanical deformation,printed electronics,reliability,test apparatus,flexible electronics
更新于2025-09-23 15:22:29
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[IEEE 2018 International Flexible Electronics Technology Conference (IFETC) - Ottawa, ON, Canada (2018.8.7-2018.8.9)] 2018 International Flexible Electronics Technology Conference (IFETC) - Deformable User Interfaces: Using Flexible Electronics for Human Computer Interaction
摘要： Deformable inputs offer users the ability to physically manipulate a device for system interaction. We combine flexible electronic technologies with human computer interaction to study how changing the form factor of digital devices can offer new interaction techniques to users. We introduce our research on deformable user interfaces by discussing bend gestures as a source of input, presenting our process to rapidly prototype flexible devices, and demonstrate three deformable user interfaces: bend passwords, bend for mobile games, and bend for vision impaired users. We show how flexible devices and deformable interactions can improve how we interact with our devices.
关键词： Human Computer Interaction,Flexible Electronics,Deformable User Interfaces
更新于2025-09-23 15:22:29
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Numerical and experimental analysis of the effect of metal tie layers on improving electrical properties of gold coated poly (dimethylsiloxane) flexible multi-layered films during folding
摘要： To improve folding electrical properties of flexible electronics, this study presents a new adhesive stress analysis of depositing an adhesion layer between the conductive film electrode and the flexible substrate during folding test by a folding test platform. The folding test platform controls folding curvature of the flexible conductive substrates, folding times, and velocities in this study. Moreover, the electrical properties of flexible conductive substrates are measured during folding testing by the folding test platform. Eventually, this study successfully analyzes residual strain, adhesive stress, and electrical properties of flexible gold coated on polydimethylsiloxane substrates with chromium, nickel, and titanium adhesion layers up to 0.5/cm folding curvature during folding testing. The chromium adhesion layer had the best performance based on the largest adhesive stress, only 3.74 X resistance increase and 4.53 X maximum resistance up to 0.5/cm folding curvature during folding test by a folding test platform. The experimental result with chromium adhesion layer is consistent with adhesive stress analysis and provides a better adhesive strength between gold and polydimethylsiloxane than nickel and titanium materials for folding test. Therefore, adhesive stress analysis is adapted to evaluate the foldable electronics performance for improving folding characteristics easier.
关键词： flexible electronics,Folding electrical property,folding test platform,adhesive stress analysis,adhesion layer
更新于2025-09-23 15:22:29
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[IEEE 2017 14th IEEE India Council International Conference (INDICON) - Roorkee (2017.12.15-2017.12.17)] 2017 14th IEEE India Council International Conference (INDICON) - Paper Based Flexible Carbon-FET Devices by Embedding Si Nanoparticles in Graphite Channel
摘要： A paper based carbon-FET (C-FET) was developed with graphite as channel. The performance of the fabricated C-FET was enhanced by embedding Si nanoparticles (SiNP) with the graphite. Initially, graphite was brush coated on paper substrate by mechanically rubbing a graphite source to fabricate the channel. However, to embed SiNP, the graphite was brush coated in presence of SiNPs, which formed graphite-SiNP composite and improved the performance of the device. It was observed that due to the presence of SiNP, the effect of gate voltage was improved approximately by a factor of four. The device was operated in back gate configuration with the paper as the dielectric material. Effect of loading of SiNP was also checked and it was found that the performance of the device improved with increase in SiNP loading. Thus, a carbon-FET was demonstrated with flexible substrate, which can be useful for different sensing and flexible electronic applications. Further, it was also observed that the performance of the C-FET was improved by adding semiconducting SiNPs. This approach of fabricating flexible paper based C-FETs are expected to be applied in the development of economical, replaceable, environment friendly, and disposable biomedical or point-of-care (POC) instruments, sensors, wearable and flexible electronic devices which will be affordable for a larger section of society.
关键词： Flexible electronics,Graphite,Nanoparticles,FET
更新于2025-09-23 15:22:29