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III-V-on-Si photonic integrated circuits realized using micro-transfer-printing
摘要： Silicon photonics (SiPh) enables compact photonic integrated circuits (PICs), showing superior performance for a wide variety of applications. Various optical functions have been demonstrated on this platform that allows for complex and powerful PICs. Nevertheless, laser source integration technologies are not yet as mature, hampering the further cost reduction of the eventual Si photonic systems-on-chip and impeding the expansion of this platform to a broader range of applications. Here, we discuss a promising technology, micro-transfer-printing (μTP), for the realization of III-V-on-Si PICs. By employing a polydimethylsiloxane elastomeric stamp, the integration of III-V devices can be realized in a massively parallel manner on a wafer without substantial modifications to the SiPh process flow, leading to a significant cost reduction of the resulting III-V-on-Si PICs. This paper summarizes some of the recent developments in the use of μTP technology for realizing the integration of III-V photodiodes and lasers on Si PICs.
关键词： micro-transfer-printing,Silicon photonics,III-V-on-Si,photonic integrated circuits,laser integration
更新于2025-09-12 10:27:22
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Ultraefficient Green LEDs Using Quantum Dots in Liquid Matrix
摘要： Green spectral range, which has the highest human eye sensitivity, is one of the most fundamental colors in lighting and display. Quantum dots (QDs) offer exceptional optical properties including high quantum yield (QY), strong absorption, and narrow emission linewidths for efficient green-emitting diodes. In this article, we demonstrated QD-based light-emitting diodes (QD-LEDs) that operate at a luminous efficiency (LE) level of 95 lumens per electrical watt, the luminous efficacy of optical radiation of 409 lumens per optical watt, and external quantum efficiency (EQE) of 23.3% in the green spectral region. For that, we synthesized 1-octanethiol-capped CdSe/ZnS QDs with an absolute QY of 91% and integrated them in a liquid matrix that allows conservation of the QD efficiency in device architecture. Our simulations were in agreement with the performance of the fabricated QD-LEDs, and they showed that the QD-LEDs can be further improved to reach LE levels over 250 lm/W.
关键词： light-emitting diodes (LEDs),luminous efficiency (LE),liquid-state integration,quantum dots (QDs),External quantum efficiency (EQE)
更新于2025-09-12 10:27:22
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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Laser-Induced Trench Design, Optimisation and Validation for Restricting Capillary Underfill Spread in Advanced Packaging Configurations
摘要： Spreading of flip-chip capillary underfill material into regions of other components can complicate their assembly and/or integrity. We propose a novel, cost-effective means to control this spread through the use of thin, linear trenches of controlled depth on solder mask surfaces. To optimally exploit this method, an in-depth study is conducted to understand the underlying mechanism. Using high resolution 3D optical profilometry, trench profile is first correlated to key laser process parameters. Trench profiles are then evaluated by means of a custom designed underfill loading test vehicle in order to determine their relative effectiveness. Characterization of both the trench and restricted underfill profiles demonstrate correlation to the Gibbs’ inequality relationship for surface tension. A trench profile is identified for chip assembly that balances high underfill restricting capacity with acceptable width and depth to suit the specificity of a substrate solder mask. The restriction of underfill spreading is then investigated in the critical dispense region of a Package on Package (PoP) application comprising stringent spacing criteria between a flip chip device and proximal BGA connections. Using trenches proposed by the laser parameter study and placed as close as 0.7 mm from chip edge, successful dispense processing and subsequent underfill flow bounding are demonstrated. Finally, underfill spread and fillet formation in the presence of trenches on the non-dispense (exit) sides of a chip assembly is investigated to determine the limits of trench proximity to chip edge. Control of underfill spread is demonstrated at trench lines as close as 0.2 mm from the chip edge on the exit sides. Using comparable samples with unrestricted underfill flow, a reduction of 0.4 mm in underfill spread on each exit side is observed. Considering the possible contact angle of the underfill at the trench edge, one can model how close the trench lines should be placed to achieve a fillet height satisfying the design specifications.
关键词： ultraviolet laser,flip chip,heterogeneous integration,system in package,capillary underfill
更新于2025-09-12 10:27:22
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Silicon photodetector for integrated lithium niobate photonics
摘要： We demonstrate the integration of an amorphous silicon photodetector with a thin film lithium niobate photonic platform operating in the visible wavelength range. We present the details of the design, fabrication, integration, and experimental characterization of this metal-semiconductor-metal photodetector that features a responsivity of 22 mA/W to 37 mA/W over the wide optical bandwidth spanning in the 635 nm–850 nm wavelength range.
关键词： lithium niobate,visible wavelength range,integration,photonics,silicon photodetector
更新于2025-09-12 10:27:22
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Integration of Hybrid Plasmonic Au-BaTiO <sub/>3</sub> Metamaterial on Silicon Substrates
摘要： Silicon integration of nanoscale metamaterials is a crucial step toward low-cost and scalable optical-based integrated circuits. Here, a self-assembled epitaxial Au-BaTiO3 (Au-BTO) hybrid metamaterial with highly anisotropic optical properties has been demonstrated on Si substrates. A thin buffer layer stack (<20 nm) of TiN and SrTiO3 (STO) was applied on Si substrates to ensure the epitaxial growth of the Au-BTO hybrid films. Detailed phase composition and microstructural analyses show excellent crystallinity and epitaxial quality of the Au-BTO films. By varying the film growth condition, the density and dimension of the Au nanopillars can be tuned effectively, which leads to highly tailorable optical properties including tunable localized surface plasmon resonance (LSPR) peak and hyperbolic dispersion shift in the visible and near-infrared regime. The work highlights the feasibility of integrating epitaxial hybrid oxide-metal plasmonic metamaterials on Si towards future complex Si-based integrated photonics.
关键词： silicon integration,hyperbolic dispersion,localized surface plasmon resonance (LSPR),oxide-metal nanocomposite,Hybrid plasmonic metamaterials
更新于2025-09-12 10:27:22
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[IEEE 2018 Asia Communications and Photonics Conference (ACP) - Hangzhou (2018.10.26-2018.10.29)] 2018 Asia Communications and Photonics Conference (ACP) - A pair of integrated optoelectronic chips for optical interconnects
摘要： A pair of integrated optoelectronic chips based on VCSEL (Vertical-Cavity Surface-Emitting Laser) and PIN-PD is proposed for optical interconnects. The matched chips can realize bi-directional communications on a single fiber.
关键词： Optical interconnects,Optoelectronic integration,Laser,RCE-PD,VCSEL
更新于2025-09-12 10:27:22
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Monolithic integration of VCSEL and coupled cavity RCEPD for short-reach single-fiber bi-directional optical interconnects
摘要： In this paper, we propose a monolithic integration of vertical-cavity surface-emitting laser (VCSEL) and coupled cavity resonant cavity enhancement photodiode (ccRCEPD). Based on this structure, a couple of matched chips is designed for single fiber bidirectional optical interconnects. That type of integration can easily put VCSEL and (photodiode) PD into one package, which not only reduces the costs of the device packages and even cut the costs of the optical system like beam splitter, but also can save the space in optical transceiver to make it tight. These chips’ VCSELs show a threshold current of 1.6 mA and 1.7 mA, and a slope efficiency of 0.74 W/A and 0.97 W/A. VCSELs’ modulation bandwidth is 9.5 GHz and 11.0 GHz, and PDs’ response bandwidth is 10 GHz. Furthermore, the modulation bandwidth can be higher if the material of the multiple quantum wells (MQWs) is transformed GaAs/AlGaAs to InGaAs/AlGaAs. And by optimizing, the 3dB bandwidth of PD will be higher.
关键词： ccRCEPD,bidirectional optical interconnects,VCSEL,monolithic integration,quantum wells
更新于2025-09-12 10:27:22
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[IEEE 2019 6th International Conference on Space Science and Communication (IconSpace) - Johor Bahru, Malaysia (2019.7.28-2019.7.30)] 2019 6th International Conference on Space Science and Communication (IconSpace) - Koch Fractal Loop Circular Polarization (CP) Antenna Integrated with Solar Cells
摘要： Minimal profile antennas for wireless devices which characteristics consisted of being low cost, highly reliable, and lightweight, it bears a new challenge for the design of the antenna in wireless communications. In this paper, we propose a design of circularly polarized microstrip patch antenna integration with solar cells for green wireless applications. Two techniques have been proposed to form the prototype between the communication system (design of antenna) and solar panel (solar cell). Both methods will face two issues generally; the solar system needs to get 100% sunlight and the magnetic field produced by radio communication systems as well as the electric field produced by solar cells should not affect the efficiency. The antenna is composed of a Koch fractal loop patch and the substrate is employed using a transparent material. This enables the light to pass through with high efficiency to illuminate the solar panel cells while the RF performance is maintained with minimal degradation. The communication frequency measures 2.6, 3.5 and 4.4 GHz. CST MWS simulation is also studied and compared among the different substrates which show different results based on the same parameters, which is implemented with a lattice of 2×2 square solar cells. With this arrangement, the solar cells will be able to obtain 100% of sunlight exposure. The characteristics of the broadband are achieved by combining resonances and the minimum axial ratio points created by the driven patch and solar cell surface.
关键词： Trade-off RF transparency,Wireless communication,transparent substrate,Microstrip patch antenna,Compact Meshed patch antenna,integration antenna and solar panel,CST MWS,performances and Frequency,Gain
更新于2025-09-12 10:27:22
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A monolithically integrated micro-LED display based on GaN-on-Silicon substrate
摘要： A monolithic micro-light-emitting-diode (LED) display technology was proposed using a gallium-nitride-on-silicon substrate. An active matrix (AM) display was realized by interconnecting nitride-based LEDs as display pixels with silicon (Si) thin-film-transistors (TFTs) as driving circuitries. Metal-oxide semiconductor TFTs were fabricated on Si surface which had been exposed after the dry etching of LED epitaxial layer. The mobility and sub-threshold slope were measured as 354.3 cm2/Vs and 0.64 V/dec, respectively. A 150 pixel-per-inch 0.6-inch monolithic display was demonstrated with a 60 x 60 pixel-array AM display by an integration technology on the same substrate.
关键词： micro-LED,monolithic integration,active matrix display,GaN-on-Silicon
更新于2025-09-12 10:27:22
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The role of photovoltaics in a sustainable European energy system under variable CO <sub/>2</sub> emissions targets, transmission capacities, and costs assumptions
摘要： PyPSA-Eur-Sec-30 is an open-source, hourly resolved, networked model of the European energy system that includes one node per country as well as electricity, heating, and transport sectors. The capacity and dispatch of generation and storage technologies in every country can be cost optimized under different CO2 emissions constraints. This paper presents an overview of the most relevant results previously obtained with the model, highlighting the influence of solar photovoltaic (PV) generation on them. For 95% CO2 emissions reduction, relative to 1990 level, PV generation supplies in average 33% of the electricity demand. Southern European countries install large PV capacities together with electric batteries, while northern countries install onshore and offshore wind capacities and use hydrogen storage and reinforced interconnections to deal with wind fluctuations. The strong daily generation profile of solar PV heavily impacts the dispatch time series of backup generation and storage technologies. The optimal PV and wind capacities are investigated for variable CO2 emissions, transmission interconnection among neighbouring countries, and cost assumptions.
关键词： energy system modelling,CO2 emissions targets,sector coupling,storage,grid integration,transmission grid
更新于2025-09-12 10:27:22