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Interfacial adhesion between embedded fibre optic sensors and epoxy matrix in composites
摘要： Fibre optic (FO) sensors are becoming increasingly popular for different applications in structural monitoring. Among their excellent properties, a strong interest for this type of sensors are represented by the possibility of embedding FOs inside composite components. In this case, one of the factors that significantly influence the efficiency of the whole Structural Health Monitoring (SHM) system is the interfacial adhesion between FO sensors and the host material. The main objective of this work is to investigate the interfacial adhesion between embedded fibre optic sensors and epoxy matrix to find the best type of optical fibre to be used in epoxy matrices to produce smart composites. Four types of optical fibres with different diameters and coatings (i.e. polyimide, polyacrylate and ormoceramic) were used. Pull-out tests were carried out and different methods were used to obtain the composite/optical fibre interfacial properties. Finally, an optical microscopy and Scanning Electron Microscopy (SEM) analysis were performed to characterize the fibre/matrix interfaces. It was found that the optical fibre that presented the highest energy required for interface rupture and, consequently, less invasiveness to the host material was the ormoceramic fibre with the smallest diameter.
关键词： Structural health monitoring,Pull-out test,interfacial adhesion,fibre optics sensors
更新于2025-09-23 15:23:52
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Ultrahigh Conductivity and Superior Interfacial Adhesion of a Nanostructured, Photonic Sintered Copper Membrane for Printed Flexible Hybrid Electronics
摘要： Inkjet-printed electronics using metal particles typically lack electrical conductivity and interfacial adhesion with an underlying substrate. To address the inherent issues of printed materials, this paper introduces advanced materials and processing methodologies. Enhanced adhesion of the inkjet-printed copper (Cu) on a flexible polyimide film is achieved by using a new surface modification technique, a nanostructured self-assembled monolayer (SAM) of (3-mercaptopropyl)trimethoxysilane. A standardized adhesion test reveals the superior adhesion strength (1192.27 N/m) of printed Cu on the polymer film, while maintaining extreme mechanical flexibility proven by 100,000 bending cycles. In addition to the increased adhesion, the nanostructured SAM treatment on printed Cu prevents formation of native oxide layers. Combined with newly synthesized Cu ink and associated sintering technique with an intense pulsed ultraviolet and visible light absorption, it enables ultrahigh conductivity of printed Cu (2.3 x 10-6 ??cm), which is the highest electrical conductivity reported to date. The comprehensive materials engineering technologies offer highly reliable printing of Cu patterns for immediate use in wearable flexible hybrid electronics. In vivo demonstration of printed, skin-conformal Cu electrodes indicates a very low skin-electrode impedance (< 50 k?) without a conductive gel and successfully measures three types of biopotentials, including electrocardiograms, electromyograms, and electrooculograms.
关键词： Photonic sintering,Printed Cu membrane,Enhanced conductivity,Interfacial adhesion,Flexible hybrid electronics
更新于2025-09-23 15:21:01
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All-Waste Hybrid Composites with Waste Silicon Photovoltaic Module
摘要： Nowadays, global warming, energy issues and environmental concern have forced energy production stakeholders to find new low carbon solutions. Photovoltaic technologies as renewable energy resources represent a competitive way for the transition from conventional fossil fuels towards a renewable energy economy. The highest renewable energy systems (RES) market share is based on silicon photovoltaic (Si-PV). The installed RES have rapidly increased over the last two decades, but, after the end of their service life, they will be disposed of. Therefore, the constant increase of the installed RES has attracted the global concern due to their impact on the environment and, most of all, due to the content of their valuable resources. However, the rational management of RES waste has not been addressed so far. The paper represents an extension of a previous work focused on Si-PV recycling by developing all waste hybrid composites. The extension research conducted in this paper is related to the influence of Si-PV characteristics on the mechanical performances and water stability of the hybrid composites. All waste hybrid composites developed by embedding different Si-PV grain sizes were tested before and after water immersion in terms of mechanical strength, interfacial adhesion, crystallinity and morphology by scanning electron microscopy (SEM) analyses. The results revealed the better performance of such Si-PV composites compared to that of sieved composites even after long term water immersion. Therefore, high-content Si-PV hybrid composites could be developed without Si-PV powder sieving. Further on, all waste hybrid composites could be used as paving slabs, protective barriers for outdoor applications.
关键词： silicon photovoltaic module,water stability,all waste hybrid composite materials,interfacial adhesion,recycling,mechanical properties
更新于2025-09-16 10:30:52
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Fabrication of a Bilayer Structure of Cu and Polyimide to Realize Circuit Microminiaturization and High Interfacial Adhesion in Flexible Electronic Devices
摘要： With commercialization of the 5th generation mobile communication system and the further spread of the Internet of Things, industrial innovation is arriving with new business fields related to concepts such as high-speed communication, self-driving vehicles, and remote medicine. One of the challenges is the realization of flexible devices with high-definition circuits, which requires new fabrication techniques for Cu films on polymer substrates to meet demands and an understanding of the Cu/polymer interfacial nanostructure to assure product quality. We have developed a promising technique for the fabrication of Cu film on polyimide (PI), which consists mainly of very simple semiconductor device processes. This technique allows for control of the Cu thickness with nanometer precision to form miniaturized Cu circuits with potential advantages in terms of interfacial adhesion and material/production costs. The Cu/PI interfaces fabricated by conventional vapor deposition and the new technique are systematically analyzed using synchrotron hard-X-ray photoelectron spectroscopy (HAXPES), scanning transmission electron microscopy (STEM), and time-of-flight secondary ion mass spectroscopy (TOF-SIMS). With conventional vapor deposition, it was discovered that evaporated Cu atoms decompose the PI and an oxidation layer with a thickness of several nanometers that deteriorates the interfacial adhesion could be visualized at the Cu/PI interface. With the new technique, the decomposition of PI and interfacial oxidation are significantly suppressed. Furthermore, the proposed technique can be broadly applied to the investigation of metal/polymer interfaces fabricated by polymer coating on a metal substrate, which has so far been impossible.
关键词： STEM,TOF-SIMS,Flexible printed circuits,Microminiaturization,Interfacial adhesion,HAXPES,Flexible electronics
更新于2025-09-10 09:29:36