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[IEEE 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC) - Chicago, IL, USA (2019.6.16-2019.6.21)] 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC) - Activation Energy for Solder Bond Degradation: Thermal Cycling of Field-aged Modules at Multiple Upper Temperatures
摘要： The reliability of solder joints in the solar cell metallization-interconnect system influences the lifetime of photovoltaic modules. Two field-aged modules—one with Sn62Pb36Ag2 solder at the solder joints (Solarex MSX 60), and the other with the standard Sn60Pb40 solder (Siemens M55)—were subjected to a modified thermal cycling (TC) test of IEC 61215. Three sections in each module were maintained at 85℃, 95℃, and 105℃ during the 15-minute high temperature dwell time. Current equivalent to the module short-circuit current was injected through the module when the chamber temperature was above 25℃ to simulate regular field operation. This novel approach aims to induce thermomechanical fatigue (TMF) at the solder joints and intermetallic compound (IMC) formation at the metal/solder interfaces. The activation energy (Ea) for solder bond degradation was calculated based on the series resistance (Rs) increase in TC testing rather than power drop to avoid the effect of confounding variables. Module-level Rs increase in MSX 60 module after TC800 cycles and in M55 module after TC400 cycles was 1.22% and 183.7%, respectively. The Ea determined for the module with 2wt% Ag is 0.24 eV and for that with the standard solder is 0.27 eV. The solder bond degradation seems to have been driven by TMF rather than IMC formation for both modules.
关键词： series resistance,PV module,solder bond degradation,thermal cycling,field-aged,activation energy
更新于2025-09-23 15:21:01
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[IEEE 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC) - Chicago, IL, USA (2019.6.16-2019.6.21)] 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC) - Thermo-mechanical degradation at finger-solder interface in a crystalline silicon photovoltaic module under thermal fatigue conditions
摘要： The thermo-mechanical performance of fingers in a crystalline silicon photovoltaic (PV) cell is often discussed in the domain of solder layer degradation due to their close proximity, and vulnerability under transient temperature variations. This paper discusses thermo-mechanical damage at common interfaces of the solder layer. It was established that the finger-solder interface is most prone to breakages. Further, effect of variable solder geometrical parameters on damage accumulation at the finger-solder interface was investigated. Solder thickness was found to be a crucial parameter. The variable width simulation demonstrated increased damage accumulation due to the case of over-soldering.
关键词： fingers,photovoltaic modules,solder,thermal cycling,thermo-mechanical degradation
更新于2025-09-23 15:21:01
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[IEEE 2019 IEEE 16th International Conference on Group IV Photonics (GFP) - Singapore, Singapore (2019.8.28-2019.8.30)] 2019 IEEE 16th International Conference on Group IV Photonics (GFP) - Near Infrared Absorption Enhancement of Graphene for High-Responsivity Photodetection
摘要： As a key component in the wind turbine system, the power electronic converter and its power semiconductors suffer from complicated power loadings related to environment, and are proven to have high failure rates. Therefore, correct lifetime estimation of wind power converter is crucial for the reliability improvement and also for cost reduction of wind power technology. Unfortunately, the existing lifetime estimation methods for the power electronic converter are not yet suitable in the wind power application, because the comprehensive mission profiles are not well specified and included. Consequently, a relative more advanced approach is proposed in this paper, which is based on the loading and strength analysis of devices and takes into account different time constants of the thermal behaviors in power converter. With the established methods for loading and lifetime estimation for power devices, more detailed information of the lifetime-related performance in wind power converter can be obtained. Some experimental results are also included to validate the thermal behavior of power device under different mission profiles.
关键词： lifetime prediction,IGBT,power semiconductor device,thermal cycling,wind power,mission profiles
更新于2025-09-23 15:19:57
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Coexistence of quasi-CW and SBS-boosted self-Q-switched pulsing in ytterbium-doped fiber laser with low Q-factor cavity
摘要： As a key component in the wind turbine system, the power electronic converter and its power semiconductors suffer from complicated power loadings related to environment, and are proven to have high failure rates. Therefore, correct lifetime estimation of wind power converter is crucial for the reliability improvement and also for cost reduction of wind power technology. Unfortunately, the existing lifetime estimation methods for the power electronic converter are not yet suitable in the wind power application, because the comprehensive mission profiles are not well specified and included. Consequently, a relative more advanced approach is proposed in this paper, which is based on the loading and strength analysis of devices and takes into account different time constants of the thermal behaviors in power converter. With the established methods for loading and lifetime estimation for power devices, more detailed information of the lifetime-related performance in wind power converter can be obtained. Some experimental results are also included to validate the thermal behavior of power device under different mission profiles.
关键词： lifetime prediction,IGBT,power semiconductor device,thermal cycling,wind power,mission profiles
更新于2025-09-23 15:19:57
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Multiple epitaxial lift-off of stacked GaAs solar cells for low-cost photovoltaic applications
摘要： This paper presents a multilayer peeling from a stacked cell structure as an approach for the cost reduction of III–V solar cells. We demonstrate the separation of two-layer stacked GaAs solar cells with Al(Ga)As release layers on the GaAs substrate into individual layers without cracks. The cells in each layer peeled from the stacked structure show equivalent device performances. Thermal cycling tests with repeated heating to 85 °C and cooling to ?40 °C show that the flexible GaAs thin-film cell exhibits a high durability against temperature changes. Further, a damp heat test conducted at 85 °C and 85% humidity indicates that the cell has long-term stability. These results suggest that the flexible GaAs thin-film cells fabricated by peeling from stacked structures have a high reliability and prove that the separation of the stacked cell structures into individual layers is effective in fabricating low-cost III–V solar cells.
关键词： epitaxial lift-off,cost reduction,damp heat test,photovoltaic applications,thermal cycling,GaAs solar cells
更新于2025-09-23 15:19:57
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Solidification Effect on the Microstructure and Mechanism of Laser Solid Forming Produced Flame-Resistant Ti-35V-15Cr Alloy
摘要： The block and thin-wall Ti-35V-15Cr samples were built by laser solid forming (LSF). The extremely sensitive thermal behavior condition in LSF results in significantly different microstructure. The microstructure of LSF-produced block sample mainly consists of epitaxial columnar dendritic grains, while that of the thin-wall sample is mainly composed of near-equiaxed grains together with sub-grains formed in the near-equiaxed grains.
关键词： sub-grains,Laser solid forming,temperature gradient,Ti-35V-15Cr,thermal cycling
更新于2025-09-23 15:19:57
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Effect of phase transition stress on the photoluminescence of perovskite CH3NH3PbI3 microwires
摘要： CH3NH3PbI3 (MAPbI3) exhibits distinctive properties for applications in photovoltaics, light emitting devices, photodetectors, and fuel cells. The working temperature of an optoelectronic device affects the photophysical properties of the active material, which is closely related to the device performance. In MAPbI3, these properties are intimately connected with its crystalline structure which is temperature dependent. Here, we study the photoluminescence (PL) behavior of MAPbI3 microwires (MWs) under recursive tetragonal-to-cubic and cubic-to-tetragonal phase transitions induced by temperature cycles from 40 °C (tetragonal phase) to 80 °C (cubic phase). MWs emission exhibited an initial redshift in wavelength by increasing the temperature from the tetragonal to the cubic phase, but after several thermal cycles, this trend reversed and the emission blueshifted. In both phases independently, the emission blueshifted and became stronger with increasing the cycles. The results indicate a thermal cycling-dependent PL and a gradual crystalline structure deformation due to a reiterated change in the MWs lattice, which implies variation in the electronic bandgap along the heating–cooling process. The alteration of the electronic band structure was corroborated by thermal cycling-re?ectance measurements. The awareness behavior of material properties upon phase transitions and temperature ?uctuations is of great importance for the optimization of optoelectronic devices.
关键词： MAPbI3,optoelectronic devices,phase transition,thermal cycling,photoluminescence
更新于2025-09-23 15:19:57
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[IEEE 2019 Workshop on Recent Advances in Photonics (WRAP) - Guwahati, India (2019.12.13-2019.12.14)] 2019 Workshop on Recent Advances in Photonics (WRAP) - Shadowgraphic Imaging of Cavitation Bubble Dynamics in Pulsed Laser Ablation of a Solid in Liquid
摘要： Insulated-gate bipolar transistor (IGBT) power modules find widespread use in numerous power conversion applications where their reliability is of significant concern. Standard IGBT modules are fabricated for general-purpose applications while little has been designed for bespoke applications. However, conventional design of IGBTs can be improved by the multiobjective optimization technique. This paper proposes a novel design method to consider die-attachment solder failures induced by short power cycling and baseplate solder fatigue induced by the thermal cycling which are among major failure mechanisms of IGBTs. Thermal resistance is calculated analytically and the plastic work design is obtained with a high-fidelity finite-element model, which has been validated experimentally. The objective of minimizing the plastic work and constrain functions is formulated by the surrogate model. The nondominated sorting genetic algorithm-II is used to search for the Pareto-optimal solutions and the best design. The result of this combination generates an effective approach to optimize the physical structure of power electronic modules, taking account of historical environmental and operational conditions in the field.
关键词： fatigue,power cycling (PC),insulated-gate bipolar transistors (IGBTs),thermal cycling (TC),reliability,optimization methods,finite-element (FE) methods,Aging,multiobjective
更新于2025-09-19 17:13:59
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[IEEE IECON 2019 - 45th Annual Conference of the IEEE Industrial Electronics Society - Lisbon, Portugal (2019.10.14-2019.10.17)] IECON 2019 - 45th Annual Conference of the IEEE Industrial Electronics Society - Techno-Economic Analysis of Building Integrated Photovoltaics Electrical Installations
摘要： Insulated-gate bipolar transistor (IGBT) power modules find widespread use in numerous power conversion applications where their reliability is of significant concern. Standard IGBT modules are fabricated for general-purpose applications while little has been designed for bespoke applications. However, conventional design of IGBTs can be improved by the multiobjective optimization technique. This paper proposes a novel design method to consider die-attachment solder failures induced by short power cycling and baseplate solder fatigue induced by the thermal cycling which are among major failure mechanisms of IGBTs. Thermal resistance is calculated analytically and the plastic work design is obtained with a high-fidelity finite-element model, which has been validated experimentally. The objective of minimizing the plastic work and constrain functions is formulated by the surrogate model. The nondominated sorting genetic algorithm-II is used to search for the Pareto-optimal solutions and the best design. The result of this combination generates an effective approach to optimize the physical structure of power electronic modules, taking account of historical environmental and operational conditions in the field.
关键词： power cycling (PC),Aging,fatigue,insulated-gate bipolar transistors (IGBTs),thermal cycling (TC),multiobjective,optimization methods,reliability,finite-element (FE) methods
更新于2025-09-19 17:13:59
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[IEEE 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC) - Chicago, IL, USA (2019.6.16-2019.6.21)] 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC) - a-Si:H/c-Si interface hydrogenation for implied V <sub/>oc</sub> = 755 mV in Silicon heterojunction solar cell
摘要： Insulated-gate bipolar transistor (IGBT) power modules find widespread use in numerous power conversion applications where their reliability is of significant concern. Standard IGBT modules are fabricated for general-purpose applications while little has been designed for bespoke applications. However, conventional design of IGBTs can be improved by the multiobjective optimization technique. This paper proposes a novel design method to consider die-attachment solder failures induced by short power cycling and baseplate solder fatigue induced by the thermal cycling which are among major failure mechanisms of IGBTs. Thermal resistance is calculated analytically and the plastic work design is obtained with a high-fidelity finite-element model, which has been validated experimentally. The objective of minimizing the plastic work and constrain functions is formulated by the surrogate model. The nondominated sorting genetic algorithm-II is used to search for the Pareto-optimal solutions and the best design. The result of this combination generates an effective approach to optimize the physical structure of power electronic modules, taking account of historical environmental and operational conditions in the field.
关键词： fatigue,power cycling (PC),insulated-gate bipolar transistors (IGBTs),thermal cycling (TC),reliability,optimization methods,finite-element (FE) methods,Aging,multiobjective
更新于2025-09-19 17:13:59