研究目的
Investigating the site-controlled formation of single Si nanocrystals (NCs) in a buried SiO2 matrix for potential applications in room-temperature single electron transistors.
研究成果
The study demonstrates a novel method for the site-controlled formation of single Si NCs in a buried SiO2 layer using ion beam mixing, which is promising for potential SET devices. The NC size of 2.2 nm and its spacing of 2 nm from the Si/SiO2 interfaces indicates great potential for CMOS-compatible integration into future SET applications.
研究不足
Further minimization of the mixed volume by point-like irradiation with the focused Ne+ ion beam is prohibited by excessive sputtering and Ne bubble formation due to the high fluences required to achieve sufficient mixing.
1:Experimental Design and Method Selection
The study employs medium-energy Si+ or Ne+ ion beam mixing of Si into a buried SiO2 layer followed by thermally activated phase separation. Binary collision approximation and kinetic Monte Carlo methods are used to simulate the process.
2:Sample Selection and Data Sources
p-doped Si wafers with a specific resistivity of 10 Ω cm were used. The buried SiO2 layer was grown via thermal oxidation at 1123 K in dry O2 atmosphere, followed by RF-sputtering of an amorphous Si layer.
3:List of Experimental Equipment and Materials
200 kV ion implanter (Danfysik Model 1090), helium ion microscope (ORION NanoFab, Carl Zeiss), Allwin21? AccuThermal AW610 tool, FEI Titan 80-300 microscope.
4:Experimental Procedures and Operational Workflow
Broad-beam irradiation was performed using a 200 kV ion implanter. Focused beam irradiation was performed using a helium ion microscope. Rapid thermal processing was conducted in N2 atmosphere. Cross-sectional samples were obtained by classical lamella preparation and FIB milling.
5:Data Analysis Methods
Energy-filtered transmission electron microscopy (EFTEM) was used to analyze the Si NC size and distribution. The NC diameter was evaluated using Otsu thresholding in Fiji.
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helium ion microscope
ORION NanoFab
Carl Zeiss
Used for focused beam irradiation and imaging.
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transmission electron microscope
Titan 80-300
FEI
Used for energy-filtered transmission electron microscopy (EFTEM).
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focused ion beam
NVision 40
Zeiss
Used for milling including a lift-out process.
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ion implanter
Model 1090
Danfysik
Used for broad-beam irradiation of the samples.
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rapid thermal processing tool
Allwin21? AccuThermal AW610
Not provided
Used for rapid thermal processing of the samples.
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