研究目的
Investigating the application of TFE mask-less technology for foldable AMOLED displays to achieve high reliability and excellent bendability.
研究成果
The study successfully demonstrated the feasibility of TFE mask-less technology for foldable AMOLED displays, achieving high reliability and excellent bendability. The hybrid structure of combined CVD and ALD layers as the first inorganic layer of TFE was preferred, with BCl3 identified as an optimal etching gas. The research confirmed that both 30nm Al2O3 and the etching process have almost no influence on the optical and reliable performance of AMOLED displays with TFE mask-less technology.
研究不足
The study is limited to the evaluation of TFE mask-less technology for foldable AMOLED displays, focusing on the optimization of process routes and the role of ALD layer in TFE. The research does not explore other potential encapsulation technologies or materials beyond those mentioned.
1：Experimental Design and Method Selection:
The study involved the development of TFE with an Al2O3 layer for high water-proof and very thin thickness, deposited by low temperature atomic layer deposition (ALD) method. The TFE mask-less process was realized by adapting dry-etch parameters for Al2O3 etch.
2：Sample Selection and Data Sources:
Two types of TFE structures were comparatively evaluated, one without an ALD film and another with a hybrid structure of combined PE-CVD and ALD films.
3：List of Experimental Equipment and Materials:
Equipment used included low-temperature plasma-enhanced chemical vapor deposition (PE-CVD), ink-jet printing (IJP), and low-temperature ALD. Materials included Al2O3, SiNx, SiOx, SiOxNy, and organic ink.
4：Experimental Procedures and Operational Workflow:
The process involved depositing the first inorganic layer, applying organic ink by IJP, depositing the second inorganic layer, and etching using BCl3, CF4, and SF6 gases.
5：Data Analysis Methods:
Atomic force microscopy (AFM) was used to characterize the surface of films, and focused ion beam (FIB) was used for measuring the thickness of TFE layers.
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