研究目的
Investigating the crack propagation and stress analysis during laser cutting of glass to control crack propagation and estimate appropriate processing conditions.
研究成果
The crack steadily progressed at a distance of 150 μm from the laser irradiation position. The temperature of the glass reached the maximum (557 °C) at a point 40 μm in front of the crack tip. The maximum principal stress at the crack tip increased as the distance from the crack tip to the laser irradiation point increased. The crack developed when the maximum tensile stress of the crack tip reached 99 MPa. These findings are expected to lead to the control of crack and estimation of appropriate processing conditions in laser cutting of glass.
研究不足
The study focuses on soda-lime glass and a specific laser setup. The findings may not be directly applicable to other types of glass or laser configurations. The simulation model assumes uniform absorption coefficient of the glass and does not account for microscopic cracks on the surface.
1：Experimental Design and Method Selection:
The study involved real-time observation of crack propagation during laser cutting of glass using a high-speed camera and thermal stress simulations using the finite element method.
2：Sample Selection and Data Sources:
A 100 × 100 ×
3：1-mm3 soda-lime glass plate was used as the sample. Initial scratches were made on the end face of the glass sample for crack initiation. List of Experimental Equipment and Materials:
A fiber laser with a wavelength of 1064 nm, an output power of 100 W, and a beam diameter of
4：0 mm was used. The beam was focused using a lens with a focal length of 100 mm. A high-speed camera (VW-9000, Keyence Co.) was used for observation. Experimental Procedures and Operational Workflow:
The glass sample was fixed on a movable stage and scanned at 7 mm/s. The crack was observed in real time by reflecting light from a light source to the high-speed camera.
5：Data Analysis Methods:
The distance between the crack tip and the laser irradiation position was measured. Thermal stress simulations were performed to analyze the stress distribution during crack propagation.
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