研究目的
To overcome manufacturing limitations of silicon nitride ceramic components by proposing a hybrid laser and conventional cutting tool technique that induces controlled cracking into the material surface to facilitate machining.
研究成果
The hybrid laser and conventional cutting tool technique has proven effective in reducing grinding forces by about 30% for both high volume material removal and finishing processes on silicon nitride ceramic components. The developed models allow for optimization of process parameters, providing a useful tool for defining laser treatment strategies.
研究不足
The study focuses on silicon nitride ceramic components and may not be directly applicable to other materials without further research. The effectiveness of the hybrid process depends on the precise control of laser parameters to induce the desired crack patterns.
1：Experimental Design and Method Selection:
A hybrid solution combining laser and conventional cutting tools was designed to induce controlled cracking into the surface of silicon nitride ceramic material. The laser parameters (laser power, scanning speed, etc.) were carefully selected to ensure the crack depth was smaller than the machining depth of cut.
2：Sample Selection and Data Sources:
Experiments were carried out on 100 mm x 80 mm x 9 mm Silicon Nitride blocks (Ceradyne Ceralloy 147-31N plates).
3：List of Experimental Equipment and Materials:
Two different lasers were used for the experiments: a NUVONYX ISL-1000 M diode laser for deep grinding and a 3.3 kW diode laser for finishing operations. A CHEVALIER 1224-AD surface grinding machine equipped with a cylindrical grinding wheel (ASD150-R75B99-1/4) was used for grinding.
4：3 kW diode laser for finishing operations. A CHEVALIER 1224-AD surface grinding machine equipped with a cylindrical grinding wheel (ASD150-R75B99-1/4) was used for grinding.
Experimental Procedures and Operational Workflow:
4. Experimental Procedures and Operational Workflow: The laser treatment was performed in a preceding phase to induce cracks without thermal load on the inserts. Grinding was then carried out to remove the cracked material.
5：Data Analysis Methods:
Grinding forces were measured using a Kistler 9256C2 dynamometer connected to a data acquisition unit to compare the performance of the hybrid process on untreated and laser-treated workpieces.
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