研究目的
Investigating the interaction mechanism between ultrashort pulse laser and silicon nitride to predict ablation depth and understand laser-material interaction.
研究成果
The study successfully developed a mathematical model to predict the depth of laser ablation in Si3N4 with an accuracy of about 85%. It was found that at laser intensities higher than 1.5 × 109 W/cm2, the interaction mechanism is Multi Photon Ionization without thermal damage, whereas lower intensities result in thermal damages adjacent to the laser cut.
研究不足
The model does not account for laser energy dissipation due to collision with plasma and chemical recasts, leading to a maximum deviation of 15% in predicting laser cutting depth.
1：Experimental Design and Method Selection:
A mathematical model was developed to simulate the laser ablation process, considering Gaussian distribution of laser intensity and effects of laser scan speed.
2：Sample Selection and Data Sources:
Si3N4 (SL200-BG) was used as the workpiece material. Experiments were conducted at various laser scan speeds from 1 mm/s to 100 mm/s.
3：List of Experimental Equipment and Materials:
Picosecond laser (TRUMPF TruMicro 5050), Si3N4 ceramic alloy.
4：Experimental Procedures and Operational Workflow:
Laser ablation experiments were performed at different scan speeds to validate the model.
5：Data Analysis Methods:
The model's predictions were compared with experimental results to assess accuracy and understand the laser-material interaction mechanism.
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