研究目的
To present a microassembled three-dimensional (3D) electric field sensor (EFS) that is a chip-level compact triangular-prism-shape sensor consisting of X-, Y- and Z-axis electric field (EF) sensing chips, aiming to reduce cross-axis coupling interference and ensure orthogonality of the three sensing axes.
研究成果
The microassembled 3D EFS demonstrates reduced cross-axis coupling interference and good performance in terms of sensitivities and measurement errors. The introduction of PSPI for flexible micro-hinges and the microassembly process are key innovations. Future work could focus on further reducing measurement errors and improving sensor robustness.
研究不足
Measurement errors are within 9.33%, and cross-axis sensitivities are within 19.54%. The sensor's performance could be affected by systematic errors and EF distortion induced by calibration equipment.
