研究目的
Solving the stress problem of uncooled infrared focal plane array caused by intrinsic stress of MQWs ?lms.
研究成果
Multi-quantum wells ?lm is a promising sensitive material with high TCR and silicon based fabrication processes compatibility. The intrinsic stress problem is an important factor restricting high yield. The paper presents resistance temperature performance model of p-type semiconductor based on Boltzmann distributions, which is more accurate especially when the Fermi level enters the valence band. The thermal conductivity is 2.24 × 10^-7 W/K and the thermal capacity is 1.145 × 10^-9 J/K.
研究不足
The stress problem of pixel deformation caused by intrinsic stress of MQWs ?lms.
1:Experimental Design and Method Selection:
The paper derived the TCR expression based on Boltzmann distributions, established the relationship between energy bands level and temperature resistance performance. Critical thickness and intrinsic stress were solved.
2:Sample Selection and Data Sources:
SiGe/Si MQWs ?lms were epitaxial growth on silicon substrate by means of ultra high vacuum chemical vapor deposion (UHVCVD).
3:List of Experimental Equipment and Materials:
Silicon-germanium multi-quantum wells (MQWs) ?lm, silicon substrate, silicon nitride (SiNx), titanium (Ti), gold (Au).
4:Experimental Procedures and Operational Workflow:
The bolometer was fabricated and released without visible deformation utilizing the compensation methods. Thermal response experiments were taken without infrared radiation to characterize the performance of the bolometer.
5:Data Analysis Methods:
The thermal conductivity and capacity were calculated from the experiments.
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