研究目的
To propose a novel planar dual-band coupled-line balun with impedance transformation and high isolation, providing closed-form design equations and practical ranges for design parameters under microstrip fabrication constraints.
研究成果
The proposed dual-band planar balun demonstrates agile impedance transformation, superb matching of all three ports, and excellent isolation between two outputs. The measured results confirm the theoretical predictions, showing potential for applications in dual-band differential/balanced microwave/millimeter-wave components and systems.
研究不足
The design is constrained by conventional microstrip fabrication limitations, including the range of characteristic impedances and the practical implementation of coupled lines and transmission lines.
1:Experimental Design and Method Selection:
The design is based on the classical even-odd mode equivalent approach, utilizing four coupled-line sections, six transmission-line stubs, and an isolation resistor.
2:Sample Selection and Data Sources:
A microstrip prototype balun working at
3:0/6 GHz is designed, fabricated, and measured. List of Experimental Equipment and Materials:
The prototype is fabricated on a F4B substrate with specific dielectric constant and thickness.
4:Experimental Procedures and Operational Workflow:
The design involves calculating initial parameters, optimizing through iterations, and converting electrical parameters into physical dimensions for PCB layout.
5:Data Analysis Methods:
The performance is verified through full-wave EM simulation and measurement using a Vector Network Analyzer.
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