研究目的
Understanding the dimensional properties of materials of the laser beam on the silicon wafers where microstructures were fabricated.
研究成果
Laser micromachining is an important process in MEMS fabrication, with four main parameters (RVA-XY size, number of pulse, stage/table feed rate, and laser energy) playing crucial roles. Larger RVA sizes lead to bigger microchannel widths, while the depth is less affected by parameter variations. Surface roughness and tool performance tolerance are important considerations for optimal laser ablation settings.
研究不足
The residues and recast at the bank of the micro channel structures indicate incomplete cleaning during the ablation process, which could affect the quality of the fabrication. The cleaning process may increase the processing time.
1：Experimental Design and Method Selection:
The research focuses on laser micromachining technique for MEMS fabrication, using a KrF excimer laser with a wavelength of 248 nm. The study manipulates four main parameters: RVA-XY size, number of pulse, stage/table feed rate, and laser energy.
2：Sample Selection and Data Sources:
Silicon wafers are used as the material for fabricating microchannel structures. The pattern of the microchannel is designed using AutoCAD software.
3：List of Experimental Equipment and Materials:
RapidX 250 KrF excimer laser micromachining tool, high power microscope (HPM), Stylus Profiler, silicon wafers, buffered oxide etchant (BOE).
4：Experimental Procedures and Operational Workflow:
The process starts with cleaning the wafer surface, followed by designing the microchannel pattern in AutoCAD. The pattern is then transferred onto the silicon wafer using laser micromachining. The fabricated structures are measured and analyzed using HPM and Stylus Profiler.
5：Data Analysis Methods:
The width and depth of the microchannel structures are analyzed to understand the effects of the manipulated parameters.
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