研究目的
Investigating the recovery kinetics in high temperature annealed AlN heteroepitaxial films to determine the dominant mechanism for dislocation annihilation.
研究成果
The dominant recovery mechanism in high temperature annealing of AlN heteroepitaxial films was identified as dislocation climb through vacancy core diffusion processes. The activation energy for the recovery was estimated to be 4.3 ± 0.1 eV. The experimentally observed dislocation annihilation as a function of annealing time was explained by dislocation climb via vacancy core diffusion. Further reduction in dislocation density may be realized by enhancing vacancy diffusion and/or increasing vacancy concentration.
研究不足
The study focuses on MOCVD-grown AlN films on sapphire substrates, and the findings may not be directly applicable to AlN films grown by other methods or on different substrates. The activation energy for vacancy core diffusion was estimated, but the detailed analysis on the influence of vacancy type and its concentration on dislocation climb rate was beyond the scope of this work.