研究目的
Investigating the influence of positive voltage pulses on the HiPIMS deposition process of hard DLC coatings and their mechanical properties.
研究成果
The application of positive pulses in HiPIMS deposition enhances the ionization of sputtered carbon and argon species, leading to higher compressive residual stresses, densification of DLC coatings, and improved mechanical properties. The hardness of DLC films increased significantly with higher positive pulse voltages, indicating the potential of this method for optimizing DLC coatings.
研究不足
The study is limited to the evaluation of DLC coatings deposited with positive voltage pulses up to 500 V. The mass spectroscopy measurements could not be performed in the same chamber used for DLC coatings deposition, requiring a different vacuum system.
1:Experimental Design and Method Selection:
A novel HiPIMS method incorporating positive voltage pulses at the end of the conventional HiPIMS discharge was used. Different positive voltage amplitudes were applied to evaluate their effect on the discharge process and mechanical properties of DLC coatings.
2:Sample Selection and Data Sources:
DLC coatings were deposited onto M2 mirror polished steel substrates and SS304 stainless steel substrates for structural, mechanical characterization, and residual stress measurements.
3:List of Experimental Equipment and Materials:
A vacuum sputtering system equipped with Gencoa’s SH100400 rectangular magnetrons using graphite and WC:Co targets, and a N4E’s circular Cr target. Mass spectroscopy measurements were performed in a different vacuum system.
4:Experimental Procedures and Operational Workflow:
The deposition process involved an argon etching pretreatment, deposition of a Cr bonding layer, a WC:Co buffer layer, and finally the DLC coating using HiPIMS with and without positive voltage pulses.
5:Data Analysis Methods:
The structural properties were studied by Raman spectroscopy, residual stresses were measured with the substrate curvature method, and mechanical properties were evaluated by nanoindentation.
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Tektronix TCP303 current probes
TCP303
Tektronix
Used for current probing in the experimental setup.
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Hiden Analytical EQP 300 energy-resolved mass spectrometer
EQP 300
Hiden Analytical
Used for time-averaged energy distributions of Ar+ and C+ ions measurements.
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FEI Verios 460 Field Emission XHR-SEM
Verios 460
FEI
Used for obtaining cross-sectional images to measure the thickness of the films.
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Leica DCM 3D confocal profilometer
DCM 3D
Leica
Used for measuring the radius of curvature of the substrates.
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Gencoa’s SH100400 rectangular magnetrons
SH100400
Gencoa
Used for sputtering in the deposition process of DLC coatings.
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Pico Technology PicoScope 6403C digital oscilloscope
6403C
Pico Technology
Used for monitoring waveforms of the target voltage and the discharge target current density.
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Testec TT-HV 150 voltage
TT-HV 150
Testec
Used for voltage probing in the experimental setup.
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Renishaw inVia micro-Raman spectrometer
inVia
Renishaw
Used for Raman characterization to evaluate the structural properties of the DLC films.
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Triboindenter TI950 from Hysitron
TI950
Hysitron
Used for nanoindentation measurements to evaluate the mechanical properties of the DLC coatings.
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