摘要： Microelectronics has solved the challenge of packaging different functional elements with integrated chips (ICs) in modern computing and communication by wire bonding. Miniaturization was a trend guided by the requirements for faster, more portable and less expensive (smaller amount of materials) solutions, where wire bonding evolved to accommodate increasingly more complex 3D architectures of chips and printed circuit boards. Even faster and more robust computing and communication can be provided by using photons rather than electrons. This was one of the underlying reasons for the fast growth of optical fiber communication, which is especially efficient over large ~1000 km distances. Data transfer in microelectronics also increasingly benefits from optical interconnects, which, however, have scaling challenges at small IC dimensions. The overall trend of optical fibers prevailing over copper wire for long-distance data transfer follows the miniaturization trend, and now, a new capability has been demonstrated on the microscale. Photonic wire bonding solves the same problem as wire bonding in microelectronics, but for optical communication on the level of chip-to-chip interconnects. In a recent study, a new milestone for data transfer over a 75 km channel at a rate of ~0.8 Tbit/s was demonstrated for Si photonic transmitters co-packaged with 1.5 μm InGaAsP lasers using photonic wire bonding. Several breakthroughs were combined to achieve the record high speed of data transfer. Optical insertion losses of only 0.7 dB were demonstrated. In addition, the required photonic wire tapering for single mode fiber operation/filtering was seamlessly achieved by direct laser writing. Most importantly, photonic wire bonding solves the stringent requirements for optical alignment between components and opens the possibility for automated packaging solutions. Si photonic platforms based on well-established complementary metal-oxide-semiconductor technologies can now be combined with other light sources and nonlinear optical components based on other platforms using photonic wire bonding. This makes hybrid photonic chip modules possible. It can be seen as a manifestation of the evolving trend in modern technology where complexity develops along with miniaturization, which has been the guiding principle established in previous decades of microelectronics.