研究目的
To investigate the effect of ultrathin tantalum nitride (TaN) intermediate layers on limiting the undesirable interfacial reaction between molybdenum (Mo) and copper-zinc-tin-sulphide (CZTS), and to evaluate the ability of TaN films to limit the diffusion of S into Mo.
研究成果
The integration of TaN passivation and Cu-poor CZTS prepared by sputtering of the quaternary compound target can minimize interfacial reaction at CZTS/Mo interface, providing a pathway to enhance performance and stability of kesterite based thin film photovoltaic devices. The TaN IL shows high chemical reactivity towards S vapor, reduces S concentration in Mo, avoids creation of MoS2 layer, and reduces void formation at the back interface.
研究不足
The study is limited to the investigation of TaN intermediate layers with thicknesses from 3 nm to 12 nm and their effect on the interfacial reaction between CZTS and Mo. The research does not explore the performance of CZTS solar cells with TaN IL in actual device configurations.
1:Experimental Design and Method Selection:
The study involved the deposition of ultrathin TaN intermediate layers (IL) with thicknesses from 3 nm to 12 nm on Mo films, followed by the deposition of CZTS films using RF sputtering from a non-stoichiometric Cu
2:69ZnSnS4 quaternary target. The samples were then annealed in the presence of elemental S vapor and Ar at 600°C for 10 min. Sample Selection and Data Sources:
Soda-lime glass (SLG) substrates were used for the deposition of Mo back electrode, TaN IL, and CZTS films.
3:List of Experimental Equipment and Materials:
A Denton Discovery-18 sputtering system was used for Mo and TaN deposition, and a Bruker D8 general area detector X-ray diffraction (XRD) system for crystal quality characterization. Other equipment included a Raman measurement system, XPS system, TOFSIMS system, and STEM for detailed analysis.
4:Experimental Procedures and Operational Workflow:
After deposition, the samples were characterized using various techniques to study their morphology, chemical and structural properties, and elemental composition before and after sulphurization.
5:Data Analysis Methods:
The data obtained from the various characterization techniques were analyzed to understand the effect of TaN IL on the interfacial reaction between CZTS and Mo, and the diffusion of S into Mo.
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Bruker D8 general area detector X-ray diffraction (XRD) system
D8
Bruker
Used for crystal quality characterization of the samples.
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FEI dual-beam FIB Helios workstation
Helios
FEI
Used to prepare the TEM lamellae for STEM imaging, EDX spectroscopy and EELS analysis.
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JEOL ARM200F TEM
ARM200F
JEOL
Used for STEM investigations.
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JEOL GrandARM300F TEM
GrandARM300F
JEOL
Used for elemental analysis at 300 kV.
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JEOL FESEM JSM 6700F
JSM 6700F
JEOL
Used for surface morphology study.
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Denton Discovery-18 sputtering system
Discovery-18
Denton
Used for Mo back electrode and TaN films deposition.
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Raman measurement system
Used to investigate structural and bonding properties of the samples.
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Time-of-flight secondary ion mass spectrometry (TOFSIMS) system
Used for elemental depth profile measurement.
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X-ray photoelectron spectroscopy (XPS) system
VG ESCALAB 220i-XL
VG
Used to study the surface composition of the samples.
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MicroxAct A4P-200 four-point probe automated resistivity mapping system
A4P-200
MicroxAct
Used for sheet resistance (Rs) measurement.
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