研究目的
To compare the performance of Circular Microstrip Patch Antenna (CMPA) in S-band between CMPA with soil as substrate and CMPA with RT/Duroid 5880 as substrate, aiming to prove that soil substrate can be a cost-effective alternative to RT/Duroid 5880.
研究成果
The simulation results show that the performance parameters of CMPA with soil as substrate are significantly close to those of CMPA with RT/Duroid 5880 as substrate. Soil substrate, being economical, can be a potential candidate to replace RT/Duroid 5880 in the fabrication of printed circuit antennas.
研究不足
The study is limited to simulation results and does not include physical fabrication and testing of the antennas. The comparison is based on key parameters like bandwidth, gain, and directivity, but other factors such as environmental effects on soil substrate are not considered.
1：Experimental Design and Method Selection:
The study uses Computational Electromagnetic Software FEKO (suite 7.0) for simulation. The design of CMPA is based on cavity model for analyzing the operation of MPA.
2：0) for simulation. The design of CMPA is based on cavity model for analyzing the operation of MPA.
Sample Selection and Data Sources:
2. Sample Selection and Data Sources: Two different substrate materials, soil and RT/Duroid 5880, are used for the CMPA design.
3：List of Experimental Equipment and Materials:
CADFEKO for antenna geometry construction, RT/Duroid 5880 and soil as substrates.
4：Experimental Procedures and Operational Workflow:
The antenna geometry is constructed using CADFEKO with specific dimensions. A coaxial feed is employed to energize the antenna. The simulation results are observed in POSTFEKO.
5：Data Analysis Methods:
The performance parameters such as bandwidth, gain, return loss, VSWR, and input impedance are compared between the two substrates.
独家科研数据包，助您复现前沿成果，加速创新突破
获取完整内容
