研究目的
To implement the first 3D monocular EKF-SLAM chain on a heterogeneous architecture, on a single System on Chip (SoC), meeting the constraints of ADAS (high-throughput, low-consumption, and small-design footprint).
研究成果
The paper successfully implements a complete monocular 3D EKF-SLAM chain on a heterogeneous architecture, meeting the constraints of an ADAS. The proposed co-design approach is generic and reusable for any advanced image processing chain on a heterogeneous architecture. Original hardware accelerators for image processing and algebraic operations are developed and validated, providing a good trade-off between resource consumption and performances.
研究不足
The initial software-only prototype does not meet the target throughput due to FIFO communication delays and the time needed to fetch images from a storage medium. The design footprint and power consumption are also constraints that need to be optimized.