研究目的
To design a broadband, low profile, and polarization-independent electromagnetic bandgap (EBG) absorber for wireless inter/intrachip (WIIC) communication systems and to validate its performance through simulation and analysis.
研究成果
The designed EBG absorber-based WIIC channel performs close to an AWGN channel when equipped with FEC, channel estimation, and equalization functionalities. The WIIC channel shows superior performance in the 60 GHz band compared to traditional wired PCB channels, offering a promising solution for high-speed integrated circuits.
研究不足
The study focuses on a specific frequency band (60 GHz) and may not cover all potential applications or frequency ranges. The performance comparison is limited to the designed WIIC channel and a specific wired PCB channel.
1：Experimental Design and Method Selection:
The design involves creating an EBG absorber with three consecutive octagon or decagon loops and highly-resistive FSS layers. The methodology includes simulation in HFSS and validation through equivalent circuit analysis in ADS.
2：Sample Selection and Data Sources:
The study uses a WIIC channel model in HFSS and compares it with a wired PCB channel model.
3：List of Experimental Equipment and Materials:
The absorber unit includes a resistive layer (tantalum nitride), a dielectric substrate layer (foam), and a ground layer (copper).
4：Experimental Procedures and Operational Workflow:
The process involves designing the absorber unit, simulating its performance in HFSS, constructing an equivalent circuit model in ADS, and comparing the results.
5：Data Analysis Methods:
The analysis includes extracting S-parameters, impulse responses, and transfer functions for both WIIC and wired PCB channels, followed by BER analysis.
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