研究目的
Understanding fundamental failure modes, acceleration factors, and reliability statistics of GaN products to meet market requirements, especially in the critical High Voltage Off State (HVOS) reliability stress test.
研究成果
The data presented shows that the TPH3205WSQA product exhibits reliability that is on par with high voltage silicon devices, based upon an understanding of the physics of failure, acceleration factors, and the extrinsic reliability as measured by FIT and PPM quality levels.
研究不足
The study assumes lifetime directly related to off state voltage and temperature without using any specific mission profile. Also, the acceleration of failures must be representative of normal use conditions, requiring tests to be conducted well below the breakdown region of the device.
1:Experimental Design and Method Selection:
The study involves testing statistically significant samples of GaN devices to failure under high voltage and temperature conditions to understand failure modes and acceleration factors.
2:Sample Selection and Data Sources:
A sample of 1200 parts was used, with critical tests skipped to generate sufficient numbers of infant mortality failures.
3:List of Experimental Equipment and Materials:
The device used is the TPH3205WSQA produced by Transphorm Inc.
4:Experimental Procedures and Operational Workflow:
Parts were subjected to high voltage, off state stress similar to HTRB-type testing at 800V and 85oC for 500 hours.
5:Data Analysis Methods:
Data was fitted to the Weibull distribution using JMP Software (version 13) using Maximum Likelihood.
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