1：Experimental Design and Method Selection:

The study involved fabricating five different Photo-OFET devices with varying layer structures (e.g., single-layer P3HT, bilayer P3HT/CuPc, trilayer P3HT/CuPc/P3HT) to analyze the effect of layer location on performance. A top-gate bottom-contact configuration was used with PMMA as the dielectric layer. Methods included thermal evaporation for metal and CuPc layers, spin coating for P3HT and PMMA layers, and photolithography for electrode patterning.

2：Sample Selection and Data Sources:

Glass substrates were used. Active layers were P3HT and CuPc, with thicknesses specified (e.g., 50 nm, 100 nm). Data were collected from electrical and photoresponsive characterizations under dark and illuminated conditions.

3：List of Experimental Equipment and Materials:

Equipment included a thermal evaporation system (Leybold Univax 450), spin coater, semiconductor characterization system (Keithley 4200-SCS), AFM, UV-Vis spectrophotometer (Scinco), and a halogen lamp (Olympus LG-PS2). Materials included P3HT, CuPc, PMMA, Cr, Au, Al, glass substrates, solvents like 1,2-dichlorobenzene and ethyl acetate.

4：2). Materials included P3HT, CuPc, PMMA, Cr, Au, Al, glass substrates, solvents like 1,2-dichlorobenzene and ethyl acetate. Experimental Procedures and Operational Workflow:

4. Experimental Procedures and Operational Workflow: Substrates were prepared with Cr/Au electrodes via thermal evaporation and photolithography. P3HT layers were spin-coated and annealed; CuPc layers were thermally evaporated. PMMA dielectric was spin-coated and annealed. Al gate electrodes were evaporated. Devices were characterized electrically and optically in ambient conditions.

5：Data Analysis Methods:

Electrical characteristics (transfer and output) were measured using Keithley 4200-SCS. Photoresponsivity (R) and photosensitivity (P) were calculated from current measurements under illumination. AFM and UV-Vis spectroscopy provided surface and absorption data. Equations for mobility, R, and P were applied for analysis.